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BTS410F2E3062ABUMA1

Infineon Technologies

BTS410F2E3062ABUMA1 by Infineon Technologies

BTS410F2E3062ABUMA1 by Infineon is a MOS technology peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at supply voltages ranging from 4.7V to 42V and has a nominal output peak current limit of 1.8A. This rectangular small outline package is ideal for automotive applications requiring reliable power management solutions.

Median Price

$1.815

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.815

100+ parts

-

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50

$1.815

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Chip Stock

USA . 22,160 parts In-Stock

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22,160

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Vyrian

USA . 6,112 parts In-Stock

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6,112

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VNN

France . 679 parts In-Stock

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679

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Digiode

USA . 53 parts In-Stock

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53

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$1.779

100+ parts

-

1k+ parts

$1.708

10k+ parts

-

2,000

$1.779

-

$1.708

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Modulus Dynamics

Lithuania . 2,211 parts In-Stock

1+ parts

$1.815

100+ parts

$1.742

1k+ parts

$1.670

10k+ parts

-

2,211

$1.815

$1.742

$1.670

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Argo Parts USA

USA . 1,434 parts In-Stock

1+ parts

$1.815

100+ parts

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1,434

$1.815

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Continental Prestige Electronics

USA . 447 parts In-Stock

1+ parts

$1.815

100+ parts

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10k+ parts

$1.779

447

$1.815

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-

$1.779

AZTECH Wire

Italy . 382 parts In-Stock

1+ parts

$8.064

100+ parts

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382

$8.064

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Ampacity Inc.

Singapore . 576 parts In-Stock

1+ parts

$8.500

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576

$8.500

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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A-Z Elektronik GmbH

Germany . 7,802 parts In-Stock

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7,802

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Microchip USA

USA . 200 parts In-Stock

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200

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Corphita

USA . 60 parts In-Stock

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60

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Overview

Unlock the power of your devices with the BTS410F2E3062ABUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in their products. This peripheral driver offers built-in protections against various electrical issues, providing peace of mind for users. With a wide range of applications, this product is versatile and essential for any electronic project. Experience seamless performance and efficiency with the BTS410F2E3062ABUMA1, making it the ideal choice for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring a longer lifespan for the peripheral driver.

Maximum Supply Voltage: 42 V

With a high maximum supply voltage of 42V, this peripheral driver is suitable for handling a wide range of applications and voltage requirements.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the connected devices by preventing damage from transient surges, overcurrent, overvoltage, thermal issues, and undervoltage conditions.

Nominal Output Peak Current Limit: 1.8 A

The nominal output peak current limit of 1.8A allows the peripheral driver to deliver sufficient power to connected devices, making it suitable for various applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type ensures compatibility and seamless integration of the peripheral driver with different systems and devices.

Technical Specifications

Peripheral Drivers BTS410F2E3062ABUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Additional Features:

SEATED HGT-NOM; SEATED HGT-CALCULATED

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

10 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

4.7 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Turn-off Time:

85 us

Turn-on Time:

125 us

Width:

9.25 mm

Trade Compliance

BTS410F2E3062ABUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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