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BTS282ZE3230AKSA2

Infineon Technologies

BTS282ZE3230AKSA2 by Infineon Technologies

BTS282ZE3230AKSA2 by Infineon is a N-CHANNEL FET with 49V DS breakdown voltage, 320A IDM, and 0.0095 ohm max RDS(on). Ideal for switching applications in automotive systems due to AEC-Q101 standard compliance and built-in diode & temp sensor.

Median Price

$4.620

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 480 parts In-Stock

1+ parts

$7.860

100+ parts

$3.960

1k+ parts

$3.560

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480

$7.860

$3.960

$3.560

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Rochester

USA . 225 parts In-Stock

1+ parts

-

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$3.600

1k+ parts

$3.220

10k+ parts

$3.030

225

-

$3.600

$3.220

$3.030

DigiKey

USA . 225 parts In-Stock

1+ parts

-

100+ parts

$4.740

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225

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$4.740

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Verical

USA . 225 parts In-Stock

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$4.500

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225

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$4.500

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Distributors (In-Stock)

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Digiode

USA . 370 parts In-Stock

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$3.952

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370

$3.952

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Nova Conductors

Japan . 83 parts In-Stock

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$5.010

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83

$5.010

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TME

Poland . 31 parts In-Stock

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$7.770

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$5.550

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$5.170

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31

$7.770

$5.550

$5.170

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Chip Stock

USA . 5,400 parts In-Stock

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VNN

France . 3,743 parts In-Stock

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Vyrian

USA . 2,751 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 4,587 parts In-Stock

1+ parts

$0.397

100+ parts

$0.381

1k+ parts

$0.365

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4,587

$0.397

$0.381

$0.365

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Corohmni

South Africa . 186 parts In-Stock

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$1.587

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186

$1.587

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Aztec Data Supply Inc.

USA . 312 parts In-Stock

1+ parts

$1.805

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312

$1.805

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Ampacity Inc.

Singapore . 416 parts In-Stock

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$3.540

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416

$3.540

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Corphita

USA . 152 parts In-Stock

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$3.744

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$3.744

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Component Stockers USA

USA . 840 parts In-Stock

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$4.010

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$3.770

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840

$4.010

$3.770

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Continental Prestige Electronics

USA . 468 parts In-Stock

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$6.210

100+ parts

$4.250

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468

$6.210

$4.250

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A-Z Elektronik GmbH

Germany . 9,000 parts In-Stock

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Perfect Parts

USA . 8,120 parts In-Stock

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Glotronic Ltd.

UK . 6,824 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,109 parts In-Stock

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Argo Parts USA

USA . 4,628 parts In-Stock

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Microchip USA

USA . 4,262 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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100+ parts

$4.910

1k+ parts

$4.760

10k+ parts

$4.659

2,000

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$4.910

$4.760

$4.659

iodParts Technologies Inc.

India . 2 parts In-Stock

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Overview

Unlock the power of efficiency with the BTS282ZE3230AKSA2 by Infineon Technologies. As a leader in Power Field Effect Transistors, Infineon Technologies offers unparalleled quality and reliability. This N-CHANNEL transistor boasts a single configuration with a built-in diode and temperature sensor, making it ideal for switching applications. With a minimum DS Breakdown Voltage of 49V and a maximum Drain Current of 80A, this transistor delivers exceptional performance. Whether you're in the automotive industry or looking to optimize your power management systems, the BTS282ZE3230AKSA2 provides the value, benefits, and advantages you need to succeed. Opt for excellence with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the FET, ensuring a long lifespan and reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making this FET suitable for applications requiring quick response times.

Configuration: SINGLE WITH BUILT-IN DIODE AND TEMPERATURE SENSOR

The built-in diode and temperature sensor add versatility and functionality to this FET, allowing for additional features such as over-temperature protection and reverse current flow prevention.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents and voltage levels with ease, making it an ideal choice for power control and regulation.

Minimum DS Breakdown Voltage: 49 V

With a minimum breakdown voltage of 49V, this FET can safely operate in high voltage circuits without risk of damage or failure, ensuring reliable performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic systems, making this FET versatile and adaptable to different design requirements.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and easy soldering in PCBs, ensuring a stable and reliable electrical connection for optimal performance.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode offers precise control over the FET's conductance, allowing for efficient power management and improved energy efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 320 A

With a high pulsed drain current rating of 320A, this FET can handle short-term power surges and peak currents without overheating or performance degradation, ensuring reliable operation under heavy loads.

Avalanche Energy Rating (EAS): 2000 mJ

The high avalanche energy rating of 2000mJ indicates the FET's ability to withstand voltage spikes and transient events, offering robust protection against electrical surges and ensuring long-term reliability in power-critical applications.

No. of Terminals: 7

The 7 terminals provide flexibility in circuit design and additional connectivity options for various system configurations, allowing for optimized performance and functionality in diverse applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers easy installation and secure mounting for stability in high-vibration environments, making this FET suitable for rugged applications requiring a reliable mechanical connection.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET ensures high performance, low power consumption, and reliable operation in a wide range of operating conditions, making it a cost-effective and efficient choice for power management applications.

Transistor Element Material: SILICON

The silicon transistor element material provides excellent thermal conductivity and high temperature tolerance, ensuring stable performance and efficient heat dissipation in high-power applications, making this FET a reliable choice for demanding environments.

Terminal Finish: TIN

The tin terminal finish offers corrosion resistance and excellent solderability, ensuring secure connections and long-term reliability in various environmental conditions, making this FET suitable for applications requiring durability and robustness.

Maximum Drain Current (ID): 80 A

With a maximum drain current rating of 80A, this FET can handle high power loads and current levels with efficiency and reliability, making it suitable for power control and regulation applications requiring high current handling capacity.

Maximum Drain-Source On Resistance: 0.0095 ohm

The low drain-source on resistance of 0.0095 ohms minimizes power losses and heat generation in the FET, ensuring high efficiency and optimum performance in power switching applications, making it an ideal choice for power-constrained systems.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces complexity in circuit design, allowing for easy integration and efficient connections in electronic systems, making this FET user-friendly and versatile in various applications.

Case Connection: DRAIN

The drain case connection offers a secure electrical connection and efficient heat dissipation, ensuring stable performance and reliability in high-power applications, making this FET suitable for demanding environments requiring robust power handling capabilities.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive reliability standard ensures high quality and reliability in harsh operating conditions, making this FET a suitable choice for automotive and industrial applications requiring durable and dependable performance.

Technical Specifications

Power Field Effect Transistors (FET) BTS282ZE3230AKSA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

2000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

49 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T7

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BTS282ZE3230AKSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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