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BTS244ZE3062AATMA2

Infineon Technologies

BTS244ZE3062AATMA2 by Infineon Technologies

BTS244ZE3062AATMA2 by Infineon is a N-CHANNEL FET with 55V DS Breakdown Voltage, 188A IDM, and 1650mJ EAS. Ideal for SWITCHING applications in automotive systems due to its built-in diode and temp sensor, small outline package style, and AEC-Q101 reference standard compliance.

Median Price

$3.921

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 172 parts In-Stock

1+ parts

$5.220

100+ parts

$2.850

1k+ parts

-

10k+ parts

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172

$5.220

$2.850

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Newark

USA . 173 parts In-Stock

1+ parts

$5.620

100+ parts

$3.820

1k+ parts

$2.900

10k+ parts

-

173

$5.620

$3.820

$2.900

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Rochester

USA . 2,526 parts In-Stock

1+ parts

-

100+ parts

$2.650

1k+ parts

$2.370

10k+ parts

$2.230

2,526

-

$2.650

$2.370

$2.230

Verical

USA . 1,860 parts In-Stock

1+ parts

-

100+ parts

-

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$2.962

10k+ parts

$2.788

1,860

-

-

$2.962

$2.788

RS (Exports)

UK . 1,210 parts In-Stock

1+ parts

-

100+ parts

$4.072

1k+ parts

$3.758

10k+ parts

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1,210

-

$4.072

$3.758

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DigiKey

USA . 1,000 parts In-Stock

1+ parts

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$2.900

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1,000

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$2.900

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Element14

Singapore . 924 parts In-Stock

1+ parts

-

100+ parts

$3.921

1k+ parts

$3.076

10k+ parts

-

924

-

$3.921

$3.076

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 114 parts In-Stock

1+ parts

$2.907

100+ parts

-

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114

$2.907

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.376

100+ parts

-

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10

$3.376

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Chip Stock

USA . 9,600 parts In-Stock

1+ parts

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9,600

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Vyrian

USA . 742 parts In-Stock

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742

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VNN

France . 709 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 20,029 parts In-Stock

1+ parts

$1.298

100+ parts

$1.246

1k+ parts

$1.194

10k+ parts

-

20,029

$1.298

$1.246

$1.194

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Corohmni

South Africa . 866 parts In-Stock

1+ parts

$1.313

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866

$1.313

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Aztec Data Supply Inc.

USA . 1,329 parts In-Stock

1+ parts

$1.483

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1,329

$1.483

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Ampacity Inc.

Singapore . 1,003 parts In-Stock

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$2.580

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1,003

$2.580

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Semicontronic

India . 944 parts In-Stock

1+ parts

$2.580

100+ parts

$2.516

1k+ parts

$2.503

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944

$2.580

$2.516

$2.503

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Corphita

USA . 979 parts In-Stock

1+ parts

$2.754

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979

$2.754

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Component Stockers USA

USA . 4,565 parts In-Stock

1+ parts

$2.980

100+ parts

$2.800

1k+ parts

$2.540

10k+ parts

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4,565

$2.980

$2.800

$2.540

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Argo Parts USA

USA . 4,732 parts In-Stock

1+ parts

$3.376

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4,732

$3.376

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Continental Prestige Electronics

USA . 924 parts In-Stock

1+ parts

$4.050

100+ parts

$2.960

1k+ parts

$2.280

10k+ parts

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924

$4.050

$2.960

$2.280

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Microchip USA

USA . 125 parts In-Stock

1+ parts

$19.123

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125

$19.123

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Perfect Parts

USA . 11 parts In-Stock

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11

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Overview

Unlock the power of cutting-edge technology with the BTS244ZE3062AATMA2 by Infineon Technologies. As a leader in the industry, Infineon is known for its superior quality and reliability. This N-CHANNEL Power FET with built-in diode and temperature sensor is perfect for switching applications, offering enhanced performance and efficiency. With a high DS breakdown voltage of 55V and a maximum drain current of 35A, this transistor provides exceptional power handling capabilities. Whether you're in automotive, industrial, or consumer electronics, this product delivers the value, benefits, and advantages you need to take your projects to the next level. Choose the BTS244ZE3062AATMA2 for top-of-the-line performance and reliability every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making this product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency, making them a popular choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND TEMPERATURE SENSOR

This configuration simplifies circuit design and enhances performance by integrating additional features.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and low power consumption.

Surface Mount: YES

Surface mount technology allows for easier assembly and more compact designs, making this product suitable for space-constrained applications.

Minimum DS Breakdown Voltage: 55 V

With a high breakdown voltage, this FET can handle higher voltages without damage, ensuring reliable operation in various conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient integration into circuit layouts, saving space and enabling easier mounting.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, contributing to the overall reliability of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and efficiency in switching applications, making them a preferred choice for many designers.

Maximum Pulsed Drain Current (IDM): 188 A

With a high pulsed drain current rating, this FET can handle sudden surges of power without failure, ensuring robust performance.

Avalanche Energy Rating (EAS): 1650 mJ

The high avalanche energy rating of this FET allows it to withstand power spikes and transient events, increasing overall system reliability.

No. of Terminals: 4

The 4-terminal configuration provides flexibility in circuit connections and ensures easy integration into various types of systems.

Technical Specifications

Power Field Effect Transistors (FET) BTS244ZE3062AATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

1650 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

35 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

400 pF

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

188 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

100 ns

Maximum Turn On Time (ton):

130 ns

Trade Compliance

BTS244ZE3062AATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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