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BSZ097N04LSG

Infineon Technologies

BSZ097N04LSG by Infineon Technologies

Infineon's BSZ097N04LSG is a N-CHANNEL FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 160A IDM, 20mJ EAS, and 0.0142 ohm RDS(ON). With a max power dissipation of 35W and operating temp up to 175°C, it offers high performance in a small outline package.

Median Price

$0.652

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 157,035 parts In-Stock

1+ parts

$1.410

100+ parts

$0.571

1k+ parts

$0.384

10k+ parts

$0.297

157,035

$1.410

$0.571

$0.384

$0.297

RS (Exports)

UK . 21,655 parts In-Stock

1+ parts

-

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$0.270

21,655

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$0.270

Verical

USA . 2,788 parts In-Stock

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$0.652

10k+ parts

$0.633

2,788

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-

$0.652

$0.633

Distributors (In-Stock)

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Vyrian

USA . 882 parts In-Stock

1+ parts

$0.647

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882

$0.647

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Maritex

Poland . 4,859 parts In-Stock

1+ parts

$0.769

100+ parts

$0.454

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$0.424

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$0.372

4,859

$0.769

$0.454

$0.424

$0.372

Digiode

USA . 31 parts In-Stock

1+ parts

$0.893

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31

$0.893

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Rutronik

Germany . 105,000 parts In-Stock

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$0.280

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$0.280

Infinite Electronics LLP

India . 55,000 parts In-Stock

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55,000

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,324 parts In-Stock

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2,324

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VNN

France . 98 parts In-Stock

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98

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Nova Conductors

Japan . 16 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 100,503 parts In-Stock

1+ parts

$0.550

100+ parts

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100,503

$0.550

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Semicontronic

India . 100,487 parts In-Stock

1+ parts

$0.550

100+ parts

$0.536

1k+ parts

$0.534

10k+ parts

-

100,487

$0.550

$0.536

$0.534

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CoreStaff

Japan . 5,000 parts In-Stock

1+ parts

$0.597

100+ parts

$0.394

1k+ parts

$0.393

10k+ parts

-

5,000

$0.597

$0.394

$0.393

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.811

100+ parts

$0.770

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$0.770

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450

$0.811

$0.770

$0.770

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Corphita

USA . 715 parts In-Stock

1+ parts

$0.846

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715

$0.846

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Corohmni

South Africa . 179 parts In-Stock

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$1.436

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179

$1.436

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Modulus Dynamics

Lithuania . 431 parts In-Stock

1+ parts

$1.723

100+ parts

$1.654

1k+ parts

$1.585

10k+ parts

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431

$1.723

$1.654

$1.585

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Andel Nordic

Denmark . 888 parts In-Stock

1+ parts

$55.570

100+ parts

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$38.897

10k+ parts

$38.897

888

$55.570

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$38.897

$38.897

Lixinc

USA . 17,864 parts In-Stock

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S.R.D Solutions

India . 15,000 parts In-Stock

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Kepictronics

USA . 7,520 parts In-Stock

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Continental Prestige Electronics

USA . 6,209 parts In-Stock

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Futuretech Components

Singapore . 4,210 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,856 parts In-Stock

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Argo Parts USA

USA . 2,159 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,904 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Lucentia Tech

USA . 500 parts In-Stock

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Overview

Infineon Wireless Charging Solutions meet today's growing demand for wireless charge applications like smartphones, wearables, notebooks, and low-voltage drive devices. Infineon's highly efficient and cost-effective devices enable state-of-the-art solutions for the transmitter unit for inductive and resonant standards. Infineon devices are ready-to-use for the adapter/charger, fostering time-to-market of full wireless charging solutions. Infineon is a member of the Wireless Power Consortium and the AirFuel Alliance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used in power applications due to their high efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, increasing overall efficiency.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast response times and high efficiency in power management.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs, saving space and improving thermal performance.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltages without damage, providing reliability in various applications.

Maximum Pulsed Drain Current (IDM): 160 A

The high maximum pulsed drain current allows for handling of peak loads efficiently, making it suitable for power applications.

Maximum Power Dissipation (Abs): 35 W

The high power dissipation capability ensures stable operation under heavy loads, making it ideal for high-power circuits.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high temperatures, ensuring reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) BSZ097N04LSG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.0142 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSZ097N04LSG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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