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BSZ034N04LSATMA1

Infineon Technologies

BSZ034N04LSATMA1 by Infineon Technologies

Infineon's BSZ034N04LSATMA1 is a N-CHANNEL FET with 40V DS breakdown voltage, ideal for switching applications. Featuring 160A IDM and 0.0046 ohm max RDS(on), it operates in enhancement mode with 70mJ EAS rating. This MOSFET has a square package style, no lead terminals, and drain case connection.

Median Price

$0.645

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,209 parts In-Stock

1+ parts

$0.614

100+ parts

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4,209

$0.614

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Arrow

USA . 120,000 parts In-Stock

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$0.404

120,000

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$0.404

Rochester

USA . 49,190 parts In-Stock

1+ parts

-

100+ parts

$0.469

1k+ parts

$0.390

10k+ parts

$0.347

49,190

-

$0.469

$0.390

$0.347

RS (Exports)

UK . 24,820 parts In-Stock

1+ parts

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100+ parts

$0.848

1k+ parts

$0.724

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24,820

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$0.848

$0.724

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Farnell

UK . 12,320 parts In-Stock

1+ parts

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100+ parts

$0.801

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$0.550

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$0.548

12,320

-

$0.801

$0.550

$0.548

Element14

Singapore . 12,320 parts In-Stock

1+ parts

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100+ parts

$0.707

1k+ parts

$0.486

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12,320

-

$0.707

$0.486

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Verical

USA . 1,604 parts In-Stock

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$0.645

10k+ parts

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1,604

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$0.645

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 486 parts In-Stock

1+ parts

$0.365

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486

$0.365

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.820

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300

$0.820

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NAC Semi

USA . 60,000 parts In-Stock

1+ parts

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$0.623

60,000

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$0.623

Vyrian

USA . 37,948 parts In-Stock

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37,948

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Cyclops Electronics Ltd

UK . 35,000 parts In-Stock

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IBS Electronics

USA . 15,000 parts In-Stock

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$1.080

15,000

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$1.080

ComSIT Distribution GmbH

Germany . 9,818 parts In-Stock

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9,818

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Rutronik

Germany . 5,000 parts In-Stock

1+ parts

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$0.413

5,000

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$0.413

VNN

France . 10 parts In-Stock

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10

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ABC Electronics Ltd.

UK . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 37,547 parts In-Stock

1+ parts

$0.235

100+ parts

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37,547

$0.235

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Corphita

USA . 35 parts In-Stock

1+ parts

$0.346

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35

$0.346

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Semicontronic

India . 37,665 parts In-Stock

1+ parts

$0.510

100+ parts

$0.497

1k+ parts

$0.495

10k+ parts

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37,665

$0.510

$0.497

$0.495

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Corohmni

South Africa . 316 parts In-Stock

1+ parts

$0.746

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316

$0.746

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Argo Parts USA

USA . 4,871 parts In-Stock

1+ parts

$0.820

100+ parts

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4,871

$0.820

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Modulus Dynamics

Lithuania . 14,802 parts In-Stock

1+ parts

$1.164

100+ parts

$1.117

1k+ parts

$1.071

10k+ parts

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14,802

$1.164

$1.117

$1.071

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.173

100+ parts

$1.115

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$1.115

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40

$1.173

$1.115

$1.115

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Aztec Data Supply Inc.

USA . 2,912 parts In-Stock

1+ parts

$1.190

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2,912

$1.190

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Continental Prestige Electronics

USA . 8,625 parts In-Stock

1+ parts

$1.320

100+ parts

$0.818

1k+ parts

$0.533

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8,625

$1.320

$0.818

$0.533

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Microchip USA

USA . 2,395 parts In-Stock

1+ parts

$3.793

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2,395

$3.793

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Eastek

USA . 170,000 parts In-Stock

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170,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Lixinc

USA . 3,453 parts In-Stock

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3,453

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Overview

Discover the exceptional performance and reliability of the BSZ034N04LSATMA1 by Infineon Technologies, a top-tier manufacturer known for cutting-edge technology. This N-CHANNEL Power Field Effect Transistor (FET) is designed for switching applications, offering a maximum pulsing drain current of 160A and a low on-resistance of 0.0046 ohm. With a minimum breakdown voltage of 40V and an avalanche energy rating of 70mJ, this transistor provides superior quality and efficiency. Whether you're in automotive, industrial or consumer electronics, this product promises to deliver value and unmatched benefits for your applications. Choose excellence with Infineon.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability, making it a good choice for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer efficient power handling capabilities, making this product suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances overall efficiency, making this transistor a convenient and practical choice.

Transistor Application: SWITCHING

Designed for switching applications, this transistor ensures fast and reliable performance in various electronic systems.

Surface Mount: YES

With a surface-mount design, this transistor is easy to install and saves space, making it ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures protection against voltage spikes, making this transistor suitable for high-power applications.

Package Shape: SQUARE

The square package shape facilitates easy mounting and efficient heat dissipation, ensuring optimal performance in demanding environments.

Terminal Form: NO LEAD

The no-lead terminal form enhances reliability and simplifies assembly processes, making this transistor a practical choice for design engineers.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control of power flow, making this transistor ideal for high-performance circuitry.

Maximum Pulsed Drain Current (IDM): 160 A

With a high pulsed drain current rating, this transistor can handle sudden spikes in power, ensuring reliable operation in dynamic systems.

Avalanche Energy Rating (EAS): 70 mJ

The high avalanche energy rating provides protection against voltage surges, making this transistor suitable for rugged applications.

No. of Terminals: 8

With 8 terminals, this transistor offers versatile connectivity options, making it adaptable to a wide range of circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enhances thermal performance, making this transistor ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high efficiency and reliability, ensuring consistent performance in demanding applications.

Transistor Element Material: SILICON

Silicon transistor elements provide excellent conductivity and stability, making this product a reliable choice for high-power circuits.

Terminal Finish: TIN

The tin terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Maximum Drain Current (ID): 19 A

With a high maximum drain current rating, this transistor can handle substantial power loads, making it suitable for heavy-duty applications.

Maximum Drain-Source On Resistance: 0.0046 ohm

The low drain-source on resistance minimizes power loss and heat generation, ensuring efficient operation in high-current circuits.

Terminal Position: DUAL

The dual terminal position allows for flexible installation options, making this transistor versatile and easy to integrate into different system configurations.

Case Connection: DRAIN

The drain case connection simplifies circuit design and ensures efficient heat dissipation, making this transistor a reliable choice for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) BSZ034N04LSATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

70 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.0046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

160 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSZ034N04LSATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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