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BSS127L6327HTSA1

Infineon Technologies

BSS127L6327HTSA1 by Infineon Technologies

Infineon's BSS127L6327HTSA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. It features a built-in diode, 0.021A ID, and 600 ohm RDS(on). The transistor's GULL WING terminals and small outline package make it suitable for surface mount designs.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 4,235 parts In-Stock

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France . 3,924 parts In-Stock

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Digiode

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Nova Conductors

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Aztec Data Supply Inc.

USA . 1,139 parts In-Stock

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$0.340

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Corohmni

South Africa . 135 parts In-Stock

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$1.445

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Modulus Dynamics

Lithuania . 11,881 parts In-Stock

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$1.632

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$1.567

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$1.501

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Ampacity Inc.

Singapore . 693 parts In-Stock

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$5.050

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AZTECH Wire

Italy . 453 parts In-Stock

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Semicontronic

India . 728 parts In-Stock

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$26.050

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$25.399

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$25.268

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Component Stockers USA

USA . 790 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 14,787 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

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Argo Parts USA

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Overview

Unleash the power of cutting-edge technology with the BSS127L6327HTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers unparalleled quality and reliability in their Small Signal Field Effect Transistors. Ideal for switching applications, this N-CHANNEL transistor offers a built-in diode for added convenience. With a minimum DS breakdown voltage of 600V and a maximum drain-source on resistance of 600 ohm, this FET provides exceptional performance and efficiency. Upgrade your electronic devices with the BSS127L6327HTSA1 and experience the superior value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics and lower ON-state resistance compared to P-channel FETs, making them suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and offers protection against reverse voltage spikes.

Transistor Application: SWITCHING

Ideal for use in switching circuits where fast response times and high efficiency are required.

Surface Mount: YES

Suitable for automated assembly processes, saving time and cost in product manufacturing.

Minimum DS Breakdown Voltage: 600 V

Provides high voltage tolerance, making it suitable for applications that require high voltage handling capabilities.

Maximum Drain Current (ID): 0.021 A

Capable of handling currents up to 0.021 A, making it suitable for low to medium power applications.

Maximum Drain-Source On Resistance: 600 ohm

Low ON resistance helps in minimizing power losses and improving efficiency in the circuit.

Maximum Feedback Capacitance (Crss): 1.5 pF

Low feedback capacitance minimizes signal distortion and improves overall circuit performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS127L6327HTSA1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

.021 A

Maximum Drain-Source On Resistance:

600 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1.5 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS127L6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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