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BSP92PL6327

Infineon Technologies

BSP92PL6327 by Infineon Technologies

BSP92PL6327 by Infineon Technologies is a P-CHANNEL Power FET with 250V DS Breakdown Voltage and 1.8W Power Dissipation. It features a SINGLE configuration with BUILT-IN DIODE, suitable for applications requiring high drain current capabilities in small outline packages. Ideal for power management systems operating at temperatures up to 150°C.

Median Price

$0.183

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 8,338 parts In-Stock

1+ parts

$0.174

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8,338

$0.174

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Nova Conductors

Japan . 600 parts In-Stock

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$0.191

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600

$0.191

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Chip Stock

USA . 51,270 parts In-Stock

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51,270

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VNN

France . 5,873 parts In-Stock

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5,873

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ComSIT Distribution GmbH

Germany . 1,068 parts In-Stock

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1,068

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Digiode

USA . 924 parts In-Stock

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924

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J2 Sourcing AB

Sweden . 795 parts In-Stock

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795

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Vyrian

USA . 317 parts In-Stock

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317

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Zilex Electronics Inc.

Canada . 200 parts In-Stock

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200

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,629 parts In-Stock

1+ parts

$0.191

100+ parts

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$0.187

3,629

$0.191

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-

$0.187

Argo Parts USA

USA . 1,846 parts In-Stock

1+ parts

$0.191

100+ parts

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$0.185

1,846

$0.191

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$0.185

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.191

100+ parts

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$0.181

10k+ parts

$0.178

500

$0.191

-

$0.181

$0.178

Corohmni

South Africa . 270 parts In-Stock

1+ parts

$0.450

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270

$0.450

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Aztec Data Supply Inc.

USA . 2,813 parts In-Stock

1+ parts

$1.740

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2,813

$1.740

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Modulus Dynamics

Lithuania . 7,883 parts In-Stock

1+ parts

$1.851

100+ parts

$1.777

1k+ parts

$1.703

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7,883

$1.851

$1.777

$1.703

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AZTECH Wire

Italy . 787 parts In-Stock

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$5.758

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787

$5.758

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Andel Nordic

Denmark . 2,552 parts In-Stock

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$17.020

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$11.913

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$11.913

2,552

$17.020

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$11.913

$11.913

Semicontronic

India . 1,252 parts In-Stock

1+ parts

$26.050

100+ parts

$25.399

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$25.268

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1,252

$26.050

$25.399

$25.268

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Ampacity Inc.

Singapore . 370 parts In-Stock

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$40.050

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370

$40.050

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A-Z Elektronik GmbH

Germany . 10,917 parts In-Stock

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Lixinc

USA . 9,163 parts In-Stock

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Microchip USA

USA . 4,539 parts In-Stock

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4,539

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Alle Elektronik GmbH

Germany . 4,498 parts In-Stock

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Corphita

USA . 154 parts In-Stock

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Overview

Experience the seamless power and efficiency of the BSP92PL6327 by Infineon Technologies. Crafted with precision and reliability, this P-Channel Power Field Effect Transistor offers unmatched performance in a variety of applications. From its single configuration with a built-in diode to its small outline package style, this transistor is designed to optimize power management. With a maximum power dissipation of 1.8W and a minimum DS breakdown voltage of 250V, the BSP92PL6327 ensures superior functionality and durability. Trust in Infineon Technologies to deliver cutting-edge technology that meets your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Minimum DS Breakdown Voltage: 250 V

With a high breakdown voltage, this FET can handle higher voltage levels, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 1.8 W

The high power dissipation capability allows the FET to operate efficiently even under heavy loads, making it reliable in demanding conditions.

Maximum Operating Temperature: 150 °C

The FET can withstand high temperatures, ensuring stable performance even in elevated temperature environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability, making it easier to integrate the FET into electronic circuits during assembly.

Technical Specifications

Power Field Effect Transistors (FET) BSP92PL6327 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

.26 A

Maximum Drain Current (ID):

.26 A

Maximum Drain-Source On Resistance:

12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1.04 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSP92PL6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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