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BSP92PH6327

Infineon Technologies

BSP92PH6327 by Infineon Technologies

Infineon's BSP92PH6327 is a P-CHANNEL FET with 250V DS Breakdown Voltage, ideal for automotive applications. Featuring 1.04A IDM and 12 ohm RDS(on), it operates in ENHANCEMENT MODE with SILICON element material. AEC-Q101 compliant, it suits power management systems requiring high reliability and performance.

Median Price

$0.860

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,452 parts In-Stock

1+ parts

$0.860

100+ parts

$0.361

1k+ parts

$0.235

10k+ parts

$0.183

3,452

$0.860

$0.361

$0.235

$0.183

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 117 parts In-Stock

1+ parts

$0.627

100+ parts

-

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117

$0.627

-

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Bristol Electronics

USA . 8,041 parts In-Stock

1+ parts

-

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8,041

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Inventory MP

USA . 7,975 parts In-Stock

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7,975

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Vyrian

USA . 4,594 parts In-Stock

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4,594

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VNN

France . 3,298 parts In-Stock

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3,298

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Rutronik

Germany . 1,000 parts In-Stock

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-

100+ parts

-

1k+ parts

$0.185

10k+ parts

$0.148

1,000

-

-

$0.185

$0.148

LIBRA Elektronik GmbH

Germany . 823 parts In-Stock

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823

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Nova Conductors

Japan . 500 parts In-Stock

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500

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ComSIT Distribution GmbH

Germany . 110 parts In-Stock

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110

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,663 parts In-Stock

1+ parts

$0.560

100+ parts

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4,663

$0.560

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Corphita

USA . 82 parts In-Stock

1+ parts

$0.594

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82

$0.594

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Corohmni

South Africa . 1,020 parts In-Stock

1+ parts

$1.198

100+ parts

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1,020

$1.198

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Modulus Dynamics

Lithuania . 17,554 parts In-Stock

1+ parts

$1.376

100+ parts

$1.321

1k+ parts

$1.266

10k+ parts

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17,554

$1.376

$1.321

$1.266

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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A-Z Elektronik GmbH

Germany . 2,862 parts In-Stock

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2,862

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Continental Prestige Electronics

USA . 2,658 parts In-Stock

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2,658

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Argo Parts USA

USA . 785 parts In-Stock

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785

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Authorized Procurement Solutions

USA . 680 parts In-Stock

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680

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GreenTree Electronics

Israel . 680 parts In-Stock

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680

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Lixinc

USA . 253 parts In-Stock

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253

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Bastille Electronics

Australia . 32 parts In-Stock

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32

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Overview

Experience the next level of performance with the BSP92PH6327 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and reliability in their Power Field Effect Transistors. This P-CHANNEL FET offers a multitude of applications and benefits, from its single configuration with built-in diode to its high DS Breakdown Voltage of 250V. Whether you are looking for enhanced power efficiency or robust circuit protection, the BSP92PH6327 delivers value and performance that exceeds expectations. Elevate your projects with this cutting-edge technology today.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high efficiency and low power consumption, making them a good choice for battery-powered applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space on the PCB, making this FET a convenient choice for compact designs.

Minimum DS Breakdown Voltage: 250 V

With a high breakdown voltage, this FET can handle high voltage applications without the risk of damage, ensuring reliability in various scenarios.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and typically have lower power consumption, making them suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 1.04 A

The high pulsed drain current capability allows this FET to handle sudden spikes in current, making it suitable for applications with varying load requirements.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability, making this FET a durable choice for demanding applications.

Transistor Element Material: SILICON

Silicon-based FETs are known for their high conductivity and efficiency, making them a popular choice for a wide range of electronic devices.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity of the FET in various operating conditions.

Maximum Drain Current (ID): 0.26 A

The maximum drain current rating ensures that the FET can handle the required current without overheating, making it a safe and reliable choice for continuous operation.

Maximum Drain-Source On Resistance: 12 ohm

With a low drain-source on resistance, this FET minimizes power loss and heat generation, resulting in higher efficiency and better overall performance.

Case Connection: DRAIN

Having the case connection at the drain simplifies circuit layout and thermal management, making it easier to design and integrate this FET into various applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures that this FET meets the stringent requirements for automotive applications, making it a reliable choice for automotive electronics.

Technical Specifications

Power Field Effect Transistors (FET) BSP92PH6327 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (ID):

.26 A

Maximum Drain-Source On Resistance:

12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

1.04 A

Reference Standard:

AEC-Q101

Terminal Finish:

MATTE TIN

Transistor Element Material:

SILICON

Trade Compliance

BSP92PH6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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