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BSP299H6327XUSA1

Infineon Technologies

BSP299H6327XUSA1 by Infineon Technologies

Infineon's BSP299H6327XUSA1 is a N-CHANNEL FET with 500V DS breakdown voltage, 1.6A IDM, and 130mJ EAS. Ideal for power applications in automotive (AEC-Q101) and industrial sectors due to its small outline package, built-in diode, and low on-resistance of 4 ohm.

Median Price

$0.458

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 101,000 parts In-Stock

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$0.466

10k+ parts

$0.415

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$0.466

$0.415

Rochester

USA . 101,000 parts In-Stock

1+ parts

-

100+ parts

$0.449

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$0.373

10k+ parts

$0.332

101,000

-

$0.449

$0.373

$0.332

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.721

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50

$0.721

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TME

Poland . 226 parts In-Stock

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$0.800

100+ parts

$0.552

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$0.447

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226

$0.800

$0.552

$0.447

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Chip Stock

USA . 14,300 parts In-Stock

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Vyrian

USA . 7,702 parts In-Stock

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VNN

France . 4,517 parts In-Stock

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Digiode

USA . 478 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 575 parts In-Stock

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$0.360

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575

$0.360

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Continental Prestige Electronics

USA . 6,363 parts In-Stock

1+ parts

$0.721

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$0.706

6,363

$0.721

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$0.706

Argo Parts USA

USA . 2,570 parts In-Stock

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$0.721

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2,570

$0.721

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Modulus Dynamics

Lithuania . 1,656 parts In-Stock

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$1.242

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$1.192

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$1.143

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1,656

$1.242

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$1.143

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Corohmni

South Africa . 466 parts In-Stock

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$1.940

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$1.940

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AZTECH Wire

Italy . 666 parts In-Stock

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$10.892

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Ampacity Inc.

Singapore . 940 parts In-Stock

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$33.050

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940

$33.050

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Semicontronic

India . 1,248 parts In-Stock

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$49.050

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$47.824

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$47.578

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$49.050

$47.824

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Perfect Parts

USA . 63,840 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.706

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$0.685

10k+ parts

$0.670

500

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$0.706

$0.685

$0.670

Corphita

USA . 87 parts In-Stock

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Overview

Unlock the power of innovation with the BSP299H6327XUSA1 by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled quality and reliability. Ideal for a wide range of applications, this N-CHANNEL FET with a built-in diode is designed to exceed expectations. Experience enhanced performance and efficiency with its 500V breakdown voltage and 1.6A pulsed drain current. Trust in the excellence of Infineon Technologies and elevate your projects to new heights with the BSP299H6327XUSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and heat resistance, ensuring the product's longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher electron mobility, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and improves efficiency by eliminating the need for an external diode component.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high voltage applications safely and reliably.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space and reducing manufacturing costs.

Maximum Pulsed Drain Current (IDM): 1.6 A

The high pulsed drain current rating ensures the FET can handle temporary spikes in current without damage.

Avalanche Energy Rating (EAS): 130 mJ

The FET's ability to withstand avalanche energy is important for applications where high-energy spikes may occur.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low ON-resistance, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 4 ohm

Low ON-resistance reduces power loss and improves efficiency in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) BSP299H6327XUSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

130 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

.4 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

1.6 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

BSP299H6327XUSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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