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BSC600N25NS3G

Infineon Technologies

BSC600N25NS3G by Infineon Technologies

BSC600N25NS3G by Infineon is a N-CHANNEL FET with 250V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 100A and EAS of 210mJ, operating in ENHANCEMENT MODE. With a 0.06 ohm Drain-Source On Resistance and 125W Power Dissipation, it offers high performance in a small outline package.

Median Price

$2.670

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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RS (Exports)

UK . 5 parts In-Stock

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$0.580

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RS Americas

USA . 5 parts In-Stock

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$1.940

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$1.560

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$1.940

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Mouser Electronics

USA . 3,660 parts In-Stock

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$4.490

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$2.200

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$1.710

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$1.600

3,660

$4.490

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$1.600

Verical

USA . 4,990 parts In-Stock

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$3.401

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$3.129

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$3.060

4,990

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Distributors (In-Stock)

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Vyrian

USA . 801 parts In-Stock

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$1.640

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Digiode

USA . 550 parts In-Stock

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$1.843

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$1.843

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Maritex

Poland . 5,294 parts In-Stock

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$2.401

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$1.629

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$1.330

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$2.401

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Rutronik

Germany . 5,000 parts In-Stock

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$1.570

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Bristol Electronics

USA . 408 parts In-Stock

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Rebound Electronics

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Component Sense

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Native Components

USA . 30 parts In-Stock

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$0.094

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$0.090

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$0.090

Northwest PG Solutions

USA . 1,701 parts In-Stock

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$0.103

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$0.091

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Corphita

USA . 730 parts In-Stock

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$1.746

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Allen Electronics Distributors

USA . 5 parts In-Stock

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$1.820

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Modulus Dynamics

Lithuania . 5,911 parts In-Stock

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$1.869

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$1.794

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$1.719

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CoreStaff

Japan . 5,000 parts In-Stock

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$2.002

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A-Z Elektronik GmbH

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Infinite Electronics LLP (Excess)

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Perfect Parts

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Lixinc

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GreenTree Electronics

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Overview

Infineon CoolMOS™ N-Channel Power MOSFETs set the standard for high performance and energy efficiency. The Infineon OptiMOS low voltage MOSFET family demonstrates a combination of the industry's lowest on-state resistance and best switching performance in the voltage range from 20V up to 250V. The new OptiMOS 25V and 30V product family sets new standards in power density and energy efficiency for discrete power MOSFETs. These devices are application-specific optimized for power supplies of servers, notebooks, telecom / datacom switches, and more. The revolutionary Infineon CoolMOS power family sets new standards in energy efficiency and is a technology leader in high voltage MOSFETs. The CoolMOS offers a significant reduction of conduction and switching losses and enables high power density and efficiency for superior power conversion systems. CoolMOS C6 / E6 Power MOSFETs combine the advantage of state-of-the-art superjunction devices with the strengths of conventional power semiconductors. Infineon Technologies CoolMOS™ Power Transistors use the revolutionary CoolMOS™ technology for high voltage power MOSFETs, designed according to the superjunction (SJ) principle and pioneered by Infineon Technologies. CoolMOS™ C6 and E6 power transistor series combine the experience of the leading SJ MOSFET supplier with high class innovation. The resulting devices provide all the benefits of a fast switching SJ MOSFET while not sacrificing ease of use. Extremely low switching and conduction losses make switching applications even more efficient, more compact, lighter, and cooler.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation, making the transistor suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-resistance and faster switching speeds compared to P-Channel FETs, making this transistor efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling in inductive loads, providing added protection and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimized performance in applications that require frequent on/off operations.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and ensuring a compact design.

Maximum Drain-Source On Resistance: 0.06 ohm

Low on-resistance results in reduced power loss and heat generation, increasing efficiency and reliability.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this transistor can handle large amounts of power without overheating or failing.

Maximum Operating Temperature: 150 °C

Capable of operating in high-temperature environments, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) BSC600N25NS3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

210 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Reference Standard:

IEC-61249-2-21

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC600N25NS3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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