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BGB741L7ESD-E6327

Infineon Technologies

BGB741L7ESD-E6327 by Infineon Technologies

BGB741L7ESD-E6327 by Infineon Technologies is a RF & Microwave Amplifier with 3V power supply, 7 terminals, and gold finish. It operates on bipolar technology with a max current of 7.2mA. Ideal for surface mount applications in various electronic devices.

Median Price

$1.092

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 5,341 parts In-Stock

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-

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$1.092

1k+ parts

$0.978

10k+ parts

$0.923

5,341

-

$1.092

$0.978

$0.923

Distributors (In-Stock)

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Digiode

USA . 485 parts In-Stock

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$1.197

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485

$1.197

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Vyrian

USA . 13,893 parts In-Stock

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13,893

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Rutronik

Germany . 7,500 parts In-Stock

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$0.486

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$0.486

VNN

France . 3,799 parts In-Stock

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3,799

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ECAB

Sweden . 81 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Semtec, LLC

USA . 9 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,453 parts In-Stock

1+ parts

$0.892

100+ parts

$0.856

1k+ parts

$0.821

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-

3,453

$0.892

$0.856

$0.821

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Semicontronic

India . 18,229 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

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18,229

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$0.916

$0.912

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Ampacity Inc.

Singapore . 18,107 parts In-Stock

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$0.940

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Corphita

USA . 180 parts In-Stock

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$1.134

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CoreStaff

Japan . 5,341 parts In-Stock

1+ parts

$1.664

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$0.675

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$0.627

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5,341

$1.664

$0.675

$0.627

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Corohmni

South Africa . 251 parts In-Stock

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$2.463

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Perfect Parts

USA . 64,971 parts In-Stock

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A-Z Elektronik GmbH

Germany . 13,500 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Lixinc

USA . 1,757 parts In-Stock

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1,757

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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Continental Prestige Electronics

USA . 905 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Argo Parts USA

USA . 297 parts In-Stock

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297

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Overview

Infineon CoolMOS™ N-Channel Power MOSFETs set the standard for high performance and energy efficiency. The Infineon OptiMOS low voltage MOSFET family demonstrates a combination of the industry's lowest on-state resistance and best switching performance in the voltage range from 20V up to 250V. The new OptiMOS 25V and 30V product family sets new standards in power density and energy efficiency for discrete power MOSFETs. These devices are application-specific optimized for power supplies of servers, notebooks, telecom / datacom switches, and more. The revolutionary Infineon CoolMOS power family sets new standards in energy efficiency and is a technology leader in high voltage MOSFETs. The CoolMOS offers a significant reduction of conduction and switching losses and enables high power density and efficiency for superior power conversion systems. CoolMOS C6 / E6 Power MOSFETs combine the advantage of state-of-the-art superjunction devices with the strengths of conventional power semiconductors. Infineon Technologies CoolMOS™ Power Transistors use the revolutionary CoolMOS™ technology for high voltage power MOSFETs, designed according to the superjunction (SJ) principle and pioneered by Infineon Technologies. CoolMOS™ C6 and E6 power transistor series combine the experience of the leading SJ MOSFET supplier with high class innovation. The resulting devices provide all the benefits of a fast switching SJ MOSFET while not sacrificing ease of use. Extremely low switching and conduction losses make switching applications even more efficient, more compact, lighter, and cooler.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the amplifier reliable and long-lasting.

Power Supplies (V): 3

Operates on a commonly available voltage, making it compatible with various systems and easy to integrate.

No. of Terminals: 7

Offers flexibility in connecting the amplifier to other components, allowing for versatile configurations.

Terminal Finish: Gold (Au)

Gold finish ensures superior conductivity and corrosion resistance, enhancing the performance and longevity of the amplifier.

Technology: BIPOLAR

Bipolar technology provides high-quality amplification with low noise and distortion, resulting in clear and precise signal amplification.

Maximum Supply Current: 7.2 mA

Low supply current requirement helps in conserving power and reduces energy consumption, making the amplifier energy-efficient.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy installation on circuit boards, saving space and facilitating efficient assembly of electronic systems.

Technical Specifications

RF & Microwave Amplifiers BGB741L7ESD-E6327 attributes and parameters. Explore more RF & Microwave Amplifiers devices from Infineon Technologies

Specs

JESD-609 Code:

e4

Mounting Feature:

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

Package Equivalence Code:

LCC7(UNSPEC)

Power Supplies (V):

3

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

7.2 mA

Technology:

Terminal Finish:

Gold (Au)

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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