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BGB719N7ESDE6327XTMA1

Infineon Technologies

BGB719N7ESDE6327XTMA1 by Infineon Technologies

BGB719N7ESDE6327XTMA1 by Infineon Technologies is a wide band low power RF amplifier with 13 dB gain. Operating from 10 MHz to 1000 MHz, it has a characteristic impedance of 50 ohm. Ideal for applications requiring amplification in the RF and microwave range.

Median Price

$0.474

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,258 parts In-Stock

1+ parts

$0.920

100+ parts

$0.681

1k+ parts

$0.592

10k+ parts

-

2,258

$0.920

$0.681

$0.592

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Rochester

USA . 38,657 parts In-Stock

1+ parts

-

100+ parts

$0.457

1k+ parts

$0.380

10k+ parts

$0.338

38,657

-

$0.457

$0.380

$0.338

Verical

USA . 38,657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.474

10k+ parts

$0.423

38,657

-

-

$0.474

$0.423

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 822 parts In-Stock

1+ parts

$0.356

100+ parts

-

1k+ parts

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822

$0.356

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Vyrian

USA . 931 parts In-Stock

1+ parts

$0.375

100+ parts

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931

$0.375

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VNN

France . 2,022 parts In-Stock

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2,022

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 674 parts In-Stock

1+ parts

$0.338

100+ parts

-

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674

$0.338

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Corohmni

South Africa . 508 parts In-Stock

1+ parts

$2.153

100+ parts

-

1k+ parts

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508

$2.153

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-

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Modulus Dynamics

Lithuania . 2,644 parts In-Stock

1+ parts

$2.807

100+ parts

$2.695

1k+ parts

$2.582

10k+ parts

-

2,644

$2.807

$2.695

$2.582

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Perfect Parts

USA . 56,746 parts In-Stock

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56,746

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A-Z Elektronik GmbH

Germany . 5,657 parts In-Stock

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5,657

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Argo Parts USA

USA . 4,423 parts In-Stock

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4,423

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Continental Prestige Electronics

USA . 4,150 parts In-Stock

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4,150

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Alle Elektronik GmbH

Germany . 3,771 parts In-Stock

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3,771

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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1,500

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Overview

Unleash the power of seamless connectivity with the BGB719N7ESDE6327XTMA1 by Infineon Technologies. As a leader in RF & Microwave Amplifiers, Infineon delivers top-notch quality and reliability in every component. Whether you're looking to enhance your signal strength or improve your wireless communication systems, this wide band low power device offers a gain of 13 dB across a wide frequency range from 10 MHz to 1000 MHz. Elevate your performance and stay connected effortlessly with the BGB719N7ESDE6327XTMA1.

Feature Benefit Bullets

RF or Microwave Device Type: WIDE BAND LOW POWER

Wide band coverage allows for flexibility in frequency range, while low power consumption is energy-efficient.

Characteristic Impedance: 50 ohm

Matches standard impedance used in most RF systems, ensuring compatibility and efficient signal transfer.

Gain: 13 dB

Provides a significant amplification to boost signal strength for various applications.

Minimum Operating Frequency: 10 MHz

Capable of operating at lower frequencies, making it suitable for a wide range of applications including long-range communication.

Maximum Operating Frequency: 1000 MHz

Offers high frequency capability for handling a variety of signals, making it versatile for different RF and microwave applications.

Technical Specifications

RF & Microwave Amplifiers BGB719N7ESDE6327XTMA1 attributes and parameters. Explore more RF & Microwave Amplifiers devices from Infineon Technologies

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

13 dB

Maximum Operating Frequency:

1000 MHz

Minimum Operating Frequency:

10 MHz

RF or Microwave Device Type:

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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