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BFR360FH6765XTSA1

Infineon Technologies

BFR360FH6765XTSA1 by Infineon Technologies

BFR360FH6765XTSA1 by Infineon Technologies is a NPN RF BJT transistor with a max fT of 14 GHz. It has a collector-emitter voltage of 6V and collector current of 0.035A, making it suitable for amplifier applications in the S band. This surface-mount transistor comes in a small outline package with 3 terminals.

Median Price

$0.102

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,540 parts In-Stock

1+ parts

$0.063

100+ parts

-

1k+ parts

-

10k+ parts

-

3,540

$0.063

-

-

-

DigiKey

USA . 4,654 parts In-Stock

1+ parts

$0.370

100+ parts

$0.193

1k+ parts

$0.162

10k+ parts

-

4,654

$0.370

$0.193

$0.162

-

Distrelec

Netherlands . 3,000 parts In-Stock

1+ parts

$0.591

100+ parts

$0.437

1k+ parts

$0.295

10k+ parts

$0.262

3,000

$0.591

$0.437

$0.295

$0.262

Rochester

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$0.090

1k+ parts

$0.075

10k+ parts

$0.067

12,000

-

$0.090

$0.075

$0.067

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.084

9,000

-

-

-

$0.084

RS (Exports)

UK . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.096

6,000

-

-

-

$0.096

Chip1Stop

Japan . 5,940 parts In-Stock

1+ parts

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5,940

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Farnell

UK . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.136

10k+ parts

$0.135

8

-

-

$0.136

$0.135

Element14

Singapore . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.108

10k+ parts

$0.105

8

-

-

$0.108

$0.105

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 680 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

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680

$0.070

-

-

-

Digiode

USA . 191 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

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191

$0.070

-

-

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VNN

France . 697 parts In-Stock

1+ parts

-

100+ parts

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697

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Nova Conductors

Japan . 96 parts In-Stock

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96

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 18,752 parts In-Stock

1+ parts

$0.063

100+ parts

-

1k+ parts

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10k+ parts

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18,752

$0.063

-

-

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Corphita

USA . 705 parts In-Stock

1+ parts

$0.067

100+ parts

-

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705

$0.067

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.333

100+ parts

$1.213

1k+ parts

$1.093

10k+ parts

-

450

$1.333

$1.213

$1.093

-

Modulus Dynamics

Lithuania . 16,337 parts In-Stock

1+ parts

$1.627

100+ parts

$1.562

1k+ parts

$1.497

10k+ parts

-

16,337

$1.627

$1.562

$1.497

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Corohmni

South Africa . 3 parts In-Stock

1+ parts

$1.803

100+ parts

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3

$1.803

-

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Andel Nordic

Denmark . 3,876 parts In-Stock

1+ parts

$25.140

100+ parts

-

1k+ parts

$17.600

10k+ parts

$17.600

3,876

$25.140

-

$17.600

$17.600

Epart123

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

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$0.150

10k+ parts

$0.150

60,000

-

-

$0.150

$0.150

QUARKTWIN TECHNOLOGY LTD

USA . 7,378 parts In-Stock

1+ parts

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7,378

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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2,400

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Argo Parts USA

USA . 2,050 parts In-Stock

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2,050

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Continental Prestige Electronics

USA . 253 parts In-Stock

1+ parts

-

100+ parts

$0.164

1k+ parts

$0.102

10k+ parts

$0.079

253

-

$0.164

$0.102

$0.079

Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Unlock a world of possibilities with the BFR360FH6765XTSA1 by Infineon Technologies. This RF Small Signal Bipolar Junction Transistor (BJT) offers unparalleled quality and reliability. Perfect for amplifier applications in the S Band, this NPN transistor provides exceptional performance in a compact package. Infineon Technologies sets the standard for excellence in semiconductor manufacturing, ensuring that you receive a product that delivers on its promises. Maximize your efficiency and productivity with the BFR360FH6765XTSA1 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a wide range of applications.

Polarity or Channel Type: NPN

Allows for amplification of signals in electronic circuits with NPN transistors, commonly used in amplifier designs.

Configuration: SINGLE

Simplifies circuit design by using a single transistor component.

Transistor Application: AMPLIFIER

Specifically designed for amplification purposes, ensuring optimal performance in amplifier circuits.

Surface Mount: YES

Enables easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

A common shape that allows for easy integration into circuit layouts.

Highest Frequency Band: S BAND

Suitable for high-frequency applications in the S band, enabling use in a variety of RF systems.

No. of Terminals: 3

Provides the necessary connections for proper functioning in a circuit.

Package Style (Meter): SMALL OUTLINE

Compact package style that saves space and allows for high-density circuit designs.

Maximum Collector-Base Capacitance: 0.5 pF

Low capacitance can help reduce signal distortion and improve high-frequency performance.

Maximum Collector-Emitter Voltage: 6 V

Withstands up to 6 volts between the collector and emitter, suitable for low voltage applications.

Transistor Element Material: SILICON

Silicon material provides reliable and consistent performance in various operating conditions.

Maximum Collector Current (IC): 0.035 A

Handles up to 0.035 amps of collector current, suitable for low-power applications.

Terminal Position: DUAL

Dual terminal position allows for easy connection and integration into circuit layouts.

Reference Standard: AEC-Q101

Complies with AEC-Q101 automotive standard, ensuring high reliability and quality for automotive applications.

Nominal Transition Frequency (fT): 14000 MHz

High transition frequency enables fast signal amplification and high-frequency operation.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR360FH6765XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.5 pF

Maximum Collector-Emitter Voltage:

6 V

Configuration:

Highest Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-F3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR360FH6765XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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