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BC178

Infineon Technologies

BC178 by Infineon Technologies

PNP; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 200 MHz; Maximum Power Dissipation (Abs): .6 W; Maximum Collector Current (IC): .2 A;

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 7,991 parts In-Stock

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Vyrian

USA . 6,077 parts In-Stock

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Anansix

USA . 4,060 parts In-Stock

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ECAB

Sweden . 443 parts In-Stock

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Holdelec - ElecDif-Pro

France . 294 parts In-Stock

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LittleDiode

UK . 114 parts In-Stock

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ABC Electronics Ltd.

UK . 100 parts In-Stock

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100

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Corel Iberica Componentes, S.L.

Spain . 70 parts In-Stock

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70

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LWI Electronics Inc

India . 63 parts In-Stock

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Halfin

Belgium . 55 parts In-Stock

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Amar Radio Corporation

India . 18 parts In-Stock

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Donberg Electronics Ltd

Ireland . 15 parts In-Stock

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Goldney Electronics S.L.

Spain . 7 parts In-Stock

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GES GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 20,318 parts In-Stock

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$0.303

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$0.291

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$0.279

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20,318

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IDEA Electronic Components Group

UK . 3,779 parts In-Stock

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$0.457

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$0.412

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DigiPath Technology Company

USA . 4,184 parts In-Stock

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$0.860

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MKK Technologies

India . 2,078 parts In-Stock

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$0.860

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ChromeModa Solutions

Germany . 1,629 parts In-Stock

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$1.811

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$1.485

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AZTECH Wire

Italy . 418 parts In-Stock

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$9.405

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One Stop Electronics

USA . 1,785 parts In-Stock

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$32.050

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Corphita

USA . 12,666 parts In-Stock

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Problanco Electronics

Mexico . 8,206 parts In-Stock

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Kepictronics

USA . 7,642 parts In-Stock

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Northwest PG Solutions

USA . 6,190 parts In-Stock

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UNI Independent Distributors

Spain . 6,171 parts In-Stock

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SupplyDigital Components

Austria . 4,769 parts In-Stock

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Parana Technologies

USA . 4,377 parts In-Stock

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TANS Electronics

Latvia . 4,178 parts In-Stock

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Native Components

USA . 3,066 parts In-Stock

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UHIMA Technologies

Türkiye . 759 parts In-Stock

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Corohmni

South Africa . 262 parts In-Stock

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 92 parts In-Stock

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Kulean Microsystems

USA . 31 parts In-Stock

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Technical Specifications

Other Function Transistors BC178 attributes and parameters. Explore more Other Function Transistors devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

120

JESD-609 Code:

e0

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Nominal Transition Frequency (fT):

Trade Compliance

BC178 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5950-00-991-2187, 5950009912187, 5961-15-135-0231, 5961151350231, 5961-66-036-3771, 5961660363771, 6635-15-103-3011, 6635151033011

NIIN

009912187, 151350231, 660363771, 151033011

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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