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BAT6402WH6327XTSA1

Infineon Technologies

BAT6402WH6327XTSA1 by Infineon Technologies

BAT6402WH6327XTSA1 by Infineon Technologies is a Schottky rectifier diode with 40V peak reverse voltage and 0.25A output current. It has a fast 0.005us reverse recovery time, making it suitable for high-speed applications in automotive electronics due to AEC-Q101 compliance. The small outline package with dual terminals and flat form factor allows for easy surface mount installation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,994 parts In-Stock

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8,994

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VNN

France . 75 parts In-Stock

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75

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Digiode

USA . 63 parts In-Stock

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63

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Modulus Dynamics

Lithuania . 3,285 parts In-Stock

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$0.022

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$0.021

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$0.020

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3,285

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Aztec Data Supply Inc.

USA . 4,622 parts In-Stock

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$0.060

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$0.060

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Corohmni

South Africa . 579 parts In-Stock

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$0.098

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579

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Ampacity Inc.

Singapore . 1,267 parts In-Stock

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$1.010

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1,267

$1.010

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Semicontronic

India . 1,231 parts In-Stock

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$3.010

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$2.935

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$2.920

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1,231

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AZTECH Wire

Italy . 377 parts In-Stock

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$14.255

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377

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Component Stockers USA

USA . 598 parts In-Stock

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$99.990

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Perfect Parts

USA . 103,898 parts In-Stock

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Continental Prestige Electronics

USA . 2,309 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 605 parts In-Stock

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Argo Parts USA

USA . 577 parts In-Stock

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577

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Overview

The BAT6402WH6327XTSA1 by Infineon Technologies is a top-quality Schottky rectifier diode that offers fast reverse recovery time and high efficiency in a compact package. Infineon Technologies, a trusted manufacturer known for its cutting-edge technology, ensures that this diode delivers reliable performance in various applications. Whether used in power supplies, voltage clamping, or motor drive circuits, this diode provides superior functionality and durability. Experience the value and benefits of Infineon's BAT6402WH6327XTSA1 for yourself and streamline your electronic designs with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring a longer lifespan for the product.

Maximum Reverse Recovery Time: 0.005 us

The extremely fast reverse recovery time allows for efficient switching and reduces power loss in the circuit.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to place and solder the diode onto a circuit board, improving the overall assembly process.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this diode can withstand demanding industrial applications without overheating.

Technology: SCHOTTKY

The Schottky technology provides a low forward voltage drop and fast switching speeds, making this diode ideal for high-frequency applications.

Technical Specifications

Diodes & Rectifiers BAT6402WH6327XTSA1 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

40 V

Maximum Reverse Recovery Time:

.005 us

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Trade Compliance

BAT6402WH6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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