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BAT64-04TE6327

Infineon Technologies

BAT64-04TE6327 by Infineon Technologies

Infineon's BAT64-04TE6327 is a Schottky rectifier diode with 0.005 us reverse recovery time, 0.35 V forward voltage, and 40 V peak reverse voltage. Ideal for surface mount applications, it operates at up to 150°C and handles a max output current of 0.12 A.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 10,637 parts In-Stock

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France . 1,639 parts In-Stock

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Digiode

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Nova Conductors

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Modulus Dynamics

Lithuania . 20,560 parts In-Stock

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Ampacity Inc.

Singapore . 555 parts In-Stock

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Semicontronic

India . 263 parts In-Stock

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AZTECH Wire

Italy . 409 parts In-Stock

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Component Stockers USA

USA . 627 parts In-Stock

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Continental Prestige Electronics

USA . 6,165 parts In-Stock

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Argo Parts USA

USA . 4,922 parts In-Stock

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Microchip USA

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Corphita

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Corohmni

South Africa . 375 parts In-Stock

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Bastille Electronics

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Overview

Discover the cutting-edge technology of the BAT64-04TE6327 by Infineon Technologies, a high-quality rectifier diode that offers unmatched performance and reliability. Designed with Schottky technology, this surface-mount diode has a maximum forward voltage of only 0.35V and a maximum output current of 0.12A, making it ideal for a wide range of applications. Trust in the expertise of Infineon Technologies to deliver superior products that provide value and benefits to customers. Elevate your projects with the BAT64-04TE6327 and experience the advantages of precision engineering and advanced technology.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to integrate into smaller, compact electronic devices.

Maximum Reverse Recovery Time: 0.005 us

Allows for faster switching speeds, improving overall efficiency of the circuit.

Maximum Operating Temperature: 150 °C

Can withstand higher temperatures, making it suitable for a variety of operating environments.

Diode Type: RECTIFIER DIODE

Specifically designed for rectification purposes, providing reliable current flow in one direction.

Maximum Forward Voltage (VF): 0.35 V

Low forward voltage drop results in lower power dissipation and higher efficiency.

Maximum Output Current: 0.12 A

Capable of handling relatively high output currents for different applications.

Technology: SCHOTTKY

Schottky diodes have lower forward voltage drop compared to standard diodes, reducing power loss and heat generation.

Maximum Repetitive Peak Reverse Voltage: 40 V

Can safely handle high reverse voltages, protecting the circuit from damage.

Maximum Non Repetitive Peak Forward Current: 0.8 A

Capable of handling short-term peak currents, providing additional protection for the circuit.

Technical Specifications

Diodes & Rectifiers BAT64-04TE6327 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Diode Type:

Maximum Forward Voltage (VF):

.35 V

Maximum Non Repetitive Peak Forward Current:

.8 A

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.12 A

Maximum Repetitive Peak Reverse Voltage:

40 V

Maximum Reverse Recovery Time:

.005 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Trade Compliance

BAT64-04TE6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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