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BAT64-05B5003

Infineon Technologies

BAT64-05B5003 by Infineon Technologies

BAT64-05B5003 by Infineon: Schottky rectifier diode with 0.12A output current, 0.005us reverse recovery time. Common cathode config, 2 elements for small outline package. Ideal for high-speed switching applications in electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,619 parts In-Stock

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5,619

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VNN

France . 4,417 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Digiode

USA . 959 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,143 parts In-Stock

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$0.010

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2,143

$0.010

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Semicontronic

India . 1,105 parts In-Stock

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$0.010

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$0.010

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$0.010

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1,105

$0.010

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Corohmni

South Africa . 93 parts In-Stock

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$0.055

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93

$0.055

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Modulus Dynamics

Lithuania . 11,080 parts In-Stock

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$0.075

100+ parts

$0.072

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$0.069

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11,080

$0.075

$0.072

$0.069

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$0.234

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$0.213

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$0.192

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60

$0.234

$0.213

$0.192

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Ampacity Inc.

Singapore . 1,350 parts In-Stock

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$1.010

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$1.010

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AZTECH Wire

Italy . 263 parts In-Stock

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$19.295

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QUARKTWIN TECHNOLOGY LTD

USA . 20,870 parts In-Stock

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A-Z Elektronik GmbH

Germany . 13,500 parts In-Stock

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Continental Prestige Electronics

USA . 5,877 parts In-Stock

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Microchip USA

USA . 1,473 parts In-Stock

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Corphita

USA . 627 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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350

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Argo Parts USA

USA . 228 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the BAT64-05B5003 by Infineon Technologies. Crafted with precision and expertise, this diode offers superior performance and reliability for a variety of applications. Whether you're looking to enhance your electronics project or optimize your industrial equipment, this product delivers unmatched value and efficiency. Experience seamless functionality and seamless integration with this innovative solution. Elevate your projects with the BAT64-05B5003 and see the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the diode, making it suitable for a variety of applications.

Config: COMMON CATHODE, 2 ELEMENTS

Common cathode configuration with 2 elements allows for efficient and reliable operation in circuits.

Surface Mount: YES

Surface mount capability simplifies the assembly process and saves space on the circuit board.

Maximum Reverse Recovery Time: 0.005 us

Fast reverse recovery time ensures minimal power loss and high efficiency in switching applications.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy mounting on the circuit board.

No. of Terminals: 3

Having 3 terminals allows for versatile connection options in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact electronic designs.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good electrical conductivity and solderability.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connection and ensures secure mounting.

Maximum Power Dissipation: 0.25 W

With a maximum power dissipation of 0.25W, this diode can handle moderate power levels effectively.

Diode Type: RECTIFIER DIODE

Being a rectifier diode, it is suitable for converting AC to DC in power supply applications.

Maximum Output Current: 0.12 A

With a maximum output current of 0.12A, this diode can handle moderate current loads efficiently.

Technology: SCHOTTKY

Schottky technology ensures low forward voltage drop and fast switching speed, making this diode suitable for high-frequency applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

No. of Elements: 2

Having 2 elements allows for better voltage regulation and current handling capabilities in the diode.

Diode Element Material: SILICON

Silicon diode element material offers high reliability and performance in various operating conditions.

Technical Specifications

Diodes & Rectifiers BAT64-05B5003 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

3

Maximum Output Current:

.12 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Qualification:

Not Qualified

Maximum Reverse Recovery Time:

.005 us

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAT64-05B5003 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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