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BAT64-04B5003

Infineon Technologies

BAT64-04B5003 by Infineon Technologies

Infineon's BAT64-04B5003 is a Schottky rectifier diode with 40V peak reverse voltage and 0.12A output current. It features 0.005us reverse recovery time, ideal for high-speed switching applications. The diode is in a small outline package, suitable for surface mount designs requiring low power dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,002 parts In-Stock

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4,002

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VNN

France . 2,690 parts In-Stock

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2,690

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Digiode

USA . 30 parts In-Stock

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30

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Semicontronic

India . 790 parts In-Stock

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$0.010

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$0.010

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$0.010

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790

$0.010

$0.010

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.024

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$0.023

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350

$0.024

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$0.023

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Modulus Dynamics

Lithuania . 13,998 parts In-Stock

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$0.075

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$0.072

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$0.069

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13,998

$0.075

$0.072

$0.069

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Corohmni

South Africa . 7 parts In-Stock

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$0.098

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7

$0.098

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Aztec Data Supply Inc.

USA . 3,191 parts In-Stock

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$0.120

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Ampacity Inc.

Singapore . 662 parts In-Stock

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$1.010

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662

$1.010

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AZTECH Wire

Italy . 728 parts In-Stock

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$17.080

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Microchip USA

USA . 4,071 parts In-Stock

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Argo Parts USA

USA . 2,704 parts In-Stock

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Continental Prestige Electronics

USA . 660 parts In-Stock

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Bastille Electronics

Australia . 650 parts In-Stock

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Corphita

USA . 476 parts In-Stock

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476

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Overview

Experience superior performance and reliability with the BAT64-04B5003 by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and cutting-edge technology in their diodes and rectifiers. The BAT64-04B5003 boasts a fast maximum reverse recovery time of 0.005 us, making it ideal for high-speed applications. With its series connected, center tap configuration and Schottky technology, this product offers efficient power management and improved energy savings. Trust in Infineon to deliver exceptional value and benefits to your projects with the BAT64-04B5003.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides good protection against external factors, making the product durable and long-lasting.

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

This configuration allows for efficient flow of current, ensuring stable performance in various electrical circuits.

Surface Mount: YES

Being surface mountable makes installation and replacement of the diode quick and easy, saving time and effort.

Maximum Reverse Recovery Time: 0.005 us

With a fast reverse recovery time, this diode is ideal for applications where quick switching is required.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement on circuit boards, optimizing space and improving functionality.

No. of Terminals: 3

The three terminals provide flexibility in connecting the diode to different parts of a circuit, enabling versatile usage.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the diode suitable for compact electronic devices where space is limited.

Terminal Finish: MATTE TIN

The matte tin finish enhances the diode's conductivity and ensures secure connections for efficient performance.

Terminal Position: DUAL

Dual terminal positions offer multiple options for connecting the diode, providing versatility in circuit design and layout.

Maximum Power Dissipation: 0.25 W

With a high power dissipation capacity, this diode can handle demanding applications without overheating.

Diode Type: RECTIFIER DIODE

This rectifier diode is designed for converting alternating current (AC) to direct current (DC), making it suitable for various power supply applications.

Maximum Output Current: 0.12 A

The high output current rating of 0.12 A ensures reliable performance in circuits requiring moderate to high power levels.

Technology: SCHOTTKY

The Schottky technology used in this diode results in low forward voltage drop and fast switching speeds, ideal for high-frequency applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mounting and easy soldering, ensuring a reliable connection to the circuit board.

No. of Elements: 2

The two elements in this diode offer redundancy and improve reliability, making it a dependable component for critical applications.

Maximum Repetitive Peak Reverse Voltage: 40 V

With a high peak reverse voltage rating of 40 V, this diode can withstand voltage spikes and surges, protecting sensitive components in the circuit.

Diode Element Material: SILICON

Made from silicon, a reliable and widely-used semiconductor material, this diode ensures consistent performance and durability.

Technical Specifications

Diodes & Rectifiers BAT64-04B5003 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

3

Maximum Output Current:

.12 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

40 V

Maximum Reverse Recovery Time:

.005 us

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAT64-04B5003 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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