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AUIRS2301S

Infineon Technologies

AUIRS2301S by Infineon Technologies

AUIRS2301S by Infineon Technologies is a MOSFET gate driver with a supply voltage range of 5-20V, suitable for automotive applications. It features a CMOS technology, high side driver capability, and fast turn-on/off times of 0.3/0.28 us. With AEC-Q100 screening and small outline packaging, it meets automotive industry standards for reliability and performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 2,508 parts In-Stock

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2,508

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Vyrian

USA . 630 parts In-Stock

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630

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Digiode

USA . 600 parts In-Stock

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600

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,568 parts In-Stock

1+ parts

$0.500

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1,568

$0.500

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Corohmni

South Africa . 194 parts In-Stock

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$4.474

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194

$4.474

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Modulus Dynamics

Lithuania . 845 parts In-Stock

1+ parts

$8.186

100+ parts

$7.859

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$7.531

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845

$8.186

$7.859

$7.531

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AZTECH Wire

Italy . 630 parts In-Stock

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$13.381

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630

$13.381

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Continental Prestige Electronics

USA . 2,868 parts In-Stock

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Argo Parts USA

USA . 1,937 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 379 parts In-Stock

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379

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Corphita

USA . 349 parts In-Stock

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349

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Bastille Electronics

Australia . 47 parts In-Stock

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47

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Overview

Enhance the performance of your automotive applications with the AUIRS2301S MOSFET Gate Driver from Infineon Technologies. Designed with top-quality materials and advanced technology, this small yet powerful driver offers reliable operation in extreme temperatures, making it ideal for automotive use. With a quick turn-on time and high output peak current limit, this driver ensures efficient and precise control of your MOSFETs. Trust Infineon for superior products that deliver value and performance you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the internal components of the gate driver.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact electronic circuits.

Maximum Supply Voltage: 20 V

Can handle higher supply voltages, providing flexibility in power supply options for the overall system.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, making it suitable for a wide range of environments.

Nominal Output Peak Current Limit: 0.35 A

Can provide sufficient current to drive MOSFETs effectively in various applications.

Technical Specifications

MOSFET Gate Drivers AUIRS2301S attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

.35 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.28 us

Turn-on Time:

.3 us

Width:

3.9 mm

Trade Compliance

AUIRS2301S Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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