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AUIRFSA8409-7P

Infineon Technologies

AUIRFSA8409-7P by Infineon Technologies

AUIRFSA8409-7P by Infineon is a N-channel Power FET with 40V DS breakdown voltage, ideal for switching applications. It features a max pulsed drain current of 1440A and an operating temperature range from -55 to 175°C. The transistor has a built-in diode, Gull Wing terminal form, and small outline package style.

Median Price

$5.430

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 835 parts In-Stock

1+ parts

$5.430

100+ parts

$4.000

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835

$5.430

$4.000

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Distributors (In-Stock)

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Digiode

USA . 793 parts In-Stock

1+ parts

$5.158

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793

$5.158

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VNN

France . 4,330 parts In-Stock

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4,330

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Vyrian

USA . 3,341 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,880 parts In-Stock

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1,880

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Nova Conductors

Japan . 61 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,764 parts In-Stock

1+ parts

$0.920

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-

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4,764

$0.920

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Continental Prestige Electronics

USA . 935 parts In-Stock

1+ parts

$4.520

100+ parts

$2.770

1k+ parts

$2.080

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-

935

$4.520

$2.770

$2.080

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Ampacity Inc.

Singapore . 645 parts In-Stock

1+ parts

$4.620

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645

$4.620

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Semicontronic

India . 593 parts In-Stock

1+ parts

$4.620

100+ parts

$4.504

1k+ parts

$4.481

10k+ parts

-

593

$4.620

$4.504

$4.481

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Corphita

USA . 506 parts In-Stock

1+ parts

$4.887

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506

$4.887

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Modulus Dynamics

Lithuania . 24,108 parts In-Stock

1+ parts

$4.958

100+ parts

$4.760

1k+ parts

$4.561

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24,108

$4.958

$4.760

$4.561

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Corohmni

South Africa . 239 parts In-Stock

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$4.958

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239

$4.958

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$5.107

100+ parts

$4.851

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$4.851

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60

$5.107

$4.851

$4.851

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AZTECH Wire

Italy . 535 parts In-Stock

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$13.291

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535

$13.291

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Lixinc

USA . 13,092 parts In-Stock

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13,092

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Argo Parts USA

USA . 4,626 parts In-Stock

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4,626

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Perfect Parts

USA . 521 parts In-Stock

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521

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Microchip USA

USA . 417 parts In-Stock

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417

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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iodParts Technologies Inc.

India . 5 parts In-Stock

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5

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Overview

Unlock the power of efficiency and reliability with the AUIRFSA8409-7P from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for various switching applications. With a minimum DS breakdown voltage of 40V and a maximum pulsed drain current of 1440A, this transistor offers unmatched performance and durability. Trust in the advanced technology of Infineon to enhance your operations and achieve optimal results. Experience the difference with the AUIRFSA8409-7P and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and higher efficiency compared to P-channel FETs, making them a good choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better control and protection in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching operations, ensuring efficient and reliable performance in such applications.

Surface Mount: YES

Easy to mount on a PCB, saving space and simplifying the assembly process.

Maximum Pulsed Drain Current (IDM): 1440 A

High pulsed current rating allows for handling sudden surges or spikes in current without failure.

Maximum Drain Current (ID): 360 A

High continuous current rating allows for sustained operation at high power levels.

Maximum Drain-Source On Resistance: 0.00069 ohm

Low on-resistance leads to minimal power dissipation and higher efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) AUIRFSA8409-7P attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1450 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

360 A

Maximum Drain-Source On Resistance:

.00069 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

1440 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

AUIRFSA8409-7P Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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