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AUIRFR8403TRLARMA1

Infineon Technologies

AUIRFR8403TRLARMA1 by Infineon Technologies

AUIRFR8403TRLARMA1 by Infineon is a N-CHANNEL FET with 40V DS breakdown voltage, ideal for switching applications. It features a max IDM of 520A and EAS of 114mJ, suitable for enhancement mode operation. This MOSFET has a drain-source on resistance of 0.0031 ohm and meets AEC-Q101 standards for automotive use.

Median Price

$1.640

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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EBV Elektronik

Germany . 9,000 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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Vyrian

USA . 2,578 parts In-Stock

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VNN

France . 1,755 parts In-Stock

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Digiode

USA . 498 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Corohmni

South Africa . 193 parts In-Stock

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$1.454

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Aztec Data Supply Inc.

USA . 79 parts In-Stock

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$1.554

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Modulus Dynamics

Lithuania . 5,660 parts In-Stock

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$1.747

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$1.677

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$1.607

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Microchip USA

USA . 9,912 parts In-Stock

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Ampacity Inc.

Singapore . 14,805 parts In-Stock

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AZTECH Wire

Italy . 623 parts In-Stock

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Eastek

USA . 72,000 parts In-Stock

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Component Stockers USA

USA . 35,878 parts In-Stock

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Continental Prestige Electronics

USA . 3,637 parts In-Stock

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Argo Parts USA

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Corphita

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Aranea Global

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Overview

Unlock the power of innovation with the AUIRFR8403TRLARMA1 by Infineon Technologies. Made by a trusted manufacturer, this Power Field Effect Transistor offers unmatched quality and reliability. Ideal for switching applications, this N-CHANNEL transistor boasts a built-in diode for added convenience. With a high pulse drain current and low on-resistance, this transistor delivers exceptional performance. Whether you're designing automotive systems or industrial equipment, this transistor is the perfect solution to optimize efficiency and effectiveness in your projects. Experience the difference with the AUIRFR8403TRLARMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used in high power applications and offer lower ON resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Minimum DS Breakdown Voltage: 40 V

Offers a high breakdown voltage to handle higher voltages in the circuit.

Maximum Pulsed Drain Current (IDM): 520 A

Capable of handling high pulsed current demands, making it suitable for power applications.

Avalanche Energy Rating (EAS): 114 mJ

Capable of withstanding avalanche energy, ensuring reliability in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology known for high switching speeds and efficiency.

Maximum Drain Current (ID): 100 A

A high drain current rating allows it to handle large amounts of current without overheating.

Maximum Drain-Source On Resistance: 0.0031 ohm

Low ON resistance results in minimal power loss and efficient operation.

Reference Standard: AEC-Q101

Complies with automotive industry standards, ensuring quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) AUIRFR8403TRLARMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

114 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

520 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

AUIRFR8403TRLARMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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