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G3R75MT12J

Genesic Semiconductor

G3R75MT12J by Genesic Semiconductor

G3R75MT12J by Genesic Semiconductor is a N-CHANNEL Power FET with 1200V DS Breakdown Voltage and 70A IDM. Ideal for SWITCHING applications, it features a SILICON CARBIDE element, 0.097 ohm Drain-Source On Resistance, and operates b/w -55 to 175 °C.

Median Price

$9.535

Lifecycle Status

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Chip1Stop

Japan . 199 parts In-Stock

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$11.000

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$7.030

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199

$11.000

$7.030

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DigiKey

USA . 2 parts In-Stock

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$11.030

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$11.030

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Arrow

USA . 800 parts In-Stock

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$8.019

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$7.402

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800

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$8.019

$7.402

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Verical

USA . 199 parts In-Stock

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$8.070

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$7.880

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199

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$8.070

$7.880

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Nova Conductors

Japan . 50 parts In-Stock

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$10.413

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Vyrian

USA . 4,880 parts In-Stock

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4,880

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$0.379

100+ parts

$0.360

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$0.360

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5,000

$0.379

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$0.360

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Aztec Data Supply Inc.

USA . 59,376 parts In-Stock

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$0.630

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$0.630

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Aranea Global

USA . 50 parts In-Stock

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$10.205

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$9.797

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$10.205

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$9.797

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Continental Prestige Electronics

USA . 686 parts In-Stock

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$10.413

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$10.205

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Microchip USA

USA . 5,238 parts In-Stock

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$30.884

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Argo Parts USA

USA . 3,454 parts In-Stock

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Overview

Experience superior performance and reliability with the G3R75MT12J by Genesic Semiconductor, a leading manufacturer in the industry. This N-CHANNEL Power FET is designed for SWITCHING applications, offering a robust design with a built-in diode for enhanced functionality. With a high minimum DS Breakdown Voltage of 1200V and maximum Pulsed Drain Current of 70A, this transistor delivers exceptional efficiency and power handling capabilities. Whether you're looking to optimize your power systems or improve switching performance, the G3R75MT12J provides the value and quality you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and low on-state resistance, making them a popular choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies circuit design and helps protect against reverse voltage spikes.

Transistor Application: SWITCHING

Designed for efficient and fast switching applications, improving overall system performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint, ideal for space-constrained designs.

Terminal Form: GULL WING

The gull wing terminals offer strong mechanical support and facilitate soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer low on-resistance and high efficiency, perfect for power switching applications.

Maximum Pulsed Drain Current (IDM): 70 A

This FET can handle high current pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 199 mJ

With a high avalanche energy rating, this FET can withstand voltage spikes without damage.

No. of Terminals: 7

Having 7 terminals provides flexibility in circuit connections and functionality.

Maximum Power Dissipation (Abs): 196 W

The high power dissipation rating ensures reliable performance under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space and facilitates efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high speed and efficiency, making it suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can perform reliably in harsh environments.

Transistor Element Material: SILICON CARBIDE

Silicon carbide offers high thermal conductivity and efficiency, enhancing the performance of the FET.

Minimum Operating Temperature: -55 °C

The wide temperature range allows for operation in extreme cold conditions.

Maximum Drain Current (ID): 38 A

Capable of handling high current, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.097 ohm

With low on-resistance, this FET minimizes power loss and improves efficiency.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and installation.

Case Connection: DRAIN

The drain connection provides sturdy mechanical support and enhances heat dissipation.

Reference Standard: IEC-60747-8-4

Compliant with industry standards for quality and performance assurance.

Technical Specifications

Power Field Effect Transistors (FET) G3R75MT12J attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Genesic Semiconductor

Specs

Avalanche Energy Rating (EAS):

199 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.097 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G7

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

70 A

Reference Standard:

IEC-60747-8-4

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

G3R75MT12J Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Genesic Semiconductor

GeneSiC is a pioneer and world leader in Silicon Carbide technology, while also invested in high power Silicon technologies. The global leading manufacturers of industrial and defense systems depend on GeneSiC's technology to elevate the performance and efficiency of their products. GeneSiC technology plays a key enabling role in conserving energy in a wide array of high power systems. Our technology enables efficient harvesting of renewable energy sources. GeneSiC electronic components run cooler, faster, and more economically. We hold leading patents on widebandgap power device technologies; a market that is projected to reach $1 billion by 2022.

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