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XPC823ZT25Z3

Freescale Semiconductor

XPC823ZT25Z3 by Freescale Semiconductor

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Median Price

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Vyrian

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Digiode

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Anansix

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Classic Components Corporation

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One Stop Electronics

USA . 1,421 parts In-Stock

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Kepictronics

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UNI Independent Distributors

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Corphita

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Perfect Parts

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Technical Specifications

Microprocessors XPC823ZT25Z3 attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor

Specs

Bit Size:

32

Boundary Scan:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Low Power Mode:

YES

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Speed:

25 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

XPC823ZT25Z3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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