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MPC7410HX400LD

Freescale Semiconductor

MPC7410HX400LD by Freescale Semiconductor

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

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USA . 2,740 parts In-Stock

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Technical Specifications

Microprocessors MPC7410HX400LD attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor

Specs

Bit Size:

32

JESD-30 Code:

S-XBGA-B360

No. of Terminals:

360

Package Body Material:

CERAMIC

Package Code:

BGA

Package Equivalence Code:

BGA360,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Speed:

400 rpm

Sub-Category:

Microprocessors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

MPC7410HX400LD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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