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ZXMN4A06GQTA

Diodes Incorporated

ZXMN4A06GQTA by Diodes Incorporated

ZXMN4A06GQTA by Diodes Inc. is a N-CHANNEL FET with 40V DS breakdown voltage, ideal for switching applications. Features include single configuration with built-in diode, 22A max pulsed drain current, and 0.05 ohm max drain-source resistance. Suitable for enhancement mode operation in automotive (AEC-Q101) and military (MIL-STD-202) environments.

Median Price

$1.498

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 771 parts In-Stock

1+ parts

$2.360

100+ parts

$1.010

1k+ parts

$0.651

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771

$2.360

$1.010

$0.651

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Verical

USA . 16,000 parts In-Stock

1+ parts

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$0.637

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16,000

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-

$0.637

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.626

100+ parts

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100

$0.626

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Vyrian

USA . 5,564 parts In-Stock

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5,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 764 parts In-Stock

1+ parts

$0.484

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-

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764

$0.484

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.626

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2,000

$0.626

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Aztec Data Supply Inc.

USA . 50 parts In-Stock

1+ parts

$1.025

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50

$1.025

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AZTECH Wire

Italy . 381 parts In-Stock

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$12.250

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381

$12.250

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock the power of innovation with the ZXMN4A06GQTA by Diodes Incorporated. This N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled quality and reliability for switching applications. With a maximum drain current of 5A and a low on-resistance of 0.05 ohm, this transistor excels in enhancing performance while maximizing efficiency. Trust in Diodes Incorporated's expertise to deliver cutting-edge technology that drives your projects forward. Experience the difference with the ZXMN4A06GQTA - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling and protection against reverse voltage, enhancing the versatility of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON resistance for high efficiency.

Surface Mount: YES

Being surface mountable makes installation easier and allows for compact designs in various electronic devices.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures reliability and protection against voltage spikes in the circuit.

Maximum Pulsed Drain Current (IDM): 22 A

The high pulsed drain current rating allows the FET to handle sudden surges in current without damage.

Maximum Power Dissipation (Abs): 2 W

With a high power dissipation rating, this FET can handle high power applications without overheating.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures reliable performance in a wide range of environments.

Maximum Drain-Source On Resistance: 0.05 ohm

The low ON resistance minimizes power loss and improves overall efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) ZXMN4A06GQTA attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

60 pF

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

22 A

Reference Standard:

AEC-Q101; MIL-STD-202

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ZXMN4A06GQTA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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