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ZXMN3A06DN8TA

Diodes Incorporated

ZXMN3A06DN8TA by Diodes Incorporated

ZXMN3A06DN8TA by Diodes Inc. is a N-CHANNEL FET with 30V DS breakdown voltage and 6.2A max drain current, ideal for switching applications. It features separate elements with built-in diode in a small outline package, operating in enhancement mode at up to 150°C. With 0.035 ohm max on resistance, this MOSFET offers efficient performance in various electronic circuits.

Median Price

$0.548

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,094 parts In-Stock

1+ parts

$2.250

100+ parts

$0.903

1k+ parts

$0.679

10k+ parts

$0.644

2,094

$2.250

$0.903

$0.679

$0.644

DigiKey

USA . 1,228 parts In-Stock

1+ parts

-

100+ parts

-

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$0.712

10k+ parts

$0.600

1,228

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$0.712

$0.600

Avnet

USA . 500 parts In-Stock

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500

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Arrow

USA . 204 parts In-Stock

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$0.385

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204

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$0.385

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Verical

USA . 204 parts In-Stock

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$0.385

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204

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$0.385

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.517

100+ parts

-

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50

$0.517

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Bristol Electronics

USA . 500 parts In-Stock

1+ parts

$1.142

100+ parts

$0.423

1k+ parts

$0.320

10k+ parts

-

500

$1.142

$0.423

$0.320

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Chip Stock

USA . 40,540 parts In-Stock

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40,540

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 933 parts In-Stock

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933

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Rebound Electronics

UK . 873 parts In-Stock

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873

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NAC Semi

USA . 500 parts In-Stock

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500

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IBS Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.655

10k+ parts

$1.445

500

-

-

$1.655

$1.445

Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

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TME

Poland . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.770

10k+ parts

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500

-

-

$0.770

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LIBRA Elektronik GmbH

Germany . 375 parts In-Stock

1+ parts

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375

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Connector Distribution Corp

USA . 300 parts In-Stock

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300

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Right Parts Inc.

USA . 300 parts In-Stock

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300

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Vyrian

USA . 226 parts In-Stock

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226

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Distributors (Availability)

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Semicontronic

India . 330 parts In-Stock

1+ parts

$0.319

100+ parts

$0.311

1k+ parts

$0.309

10k+ parts

-

330

$0.319

$0.311

$0.309

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Ampacity Inc.

Singapore . 255 parts In-Stock

1+ parts

$0.319

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255

$0.319

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.448

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$0.448

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$0.448

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40

$0.448

$0.448

$0.448

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Continental Prestige Electronics

USA . 821 parts In-Stock

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$0.517

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$0.507

821

$0.517

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$0.507

Argo Parts USA

USA . 383 parts In-Stock

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$0.517

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$0.502

383

$0.517

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$0.502

Aztec Data Supply Inc.

USA . 4,258 parts In-Stock

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$0.650

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4,258

$0.650

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Corohmni

South Africa . 911 parts In-Stock

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$0.988

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911

$0.988

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Microchip USA

USA . 3,873 parts In-Stock

1+ parts

$4.279

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3,873

$4.279

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Robosynatics

Brazil . 17,214 parts In-Stock

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Lucentia Tech

USA . 17,214 parts In-Stock

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$1.050

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$1.028

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$1.028

17,214

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$1.050

$1.028

$1.028

Lixinc

USA . 17,040 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.507

1k+ parts

$0.491

10k+ parts

$0.481

2,000

-

$0.507

$0.491

$0.481

Overview

Unlock the power of cutting-edge technology with the ZXMN3A06DN8TA by Diodes Incorporated. As a leader in small signal field effect transistors, Diodes Incorporated guarantees top-notch quality and reliability. Ideal for switching applications, this N-channel FET offers seamless performance and efficiency. With a sleek rectangular package design and gull wing terminals, this transistor is a perfect fit for any project. Experience enhanced functionality and superior results with the ZXMN3A06DN8TA, offering customers unrivaled value and convenience. Elevate your electronics with Diodes Incorporated today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and long-lasting performance of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel type transistors typically offer better efficiency and lower on-resistance compared to P-channel transistors, making this product suitable for various applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with 2 elements and built-in diode allows for better control and flexibility in circuit designs while providing protection against reverse voltage.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast switching speeds and can handle high currents, making it ideal for use in power management circuits.

Surface Mount: YES

Being surface mount technology (SMT) compatible allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Drain Current (Abs) (ID): 6.2 A

The high maximum drain current rating of 6.2 A indicates that this transistor can handle heavy loads and high-power applications reliably.

Maximum Power Dissipation (Abs): 2.1 W

With a maximum power dissipation of 2.1 W, this transistor can efficiently handle heat dissipation during operation, ensuring stable performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable performance in various environmental conditions without overheating.

Technical Specifications

Small Signal Field Effect Transistors (FET) ZXMN3A06DN8TA attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

6.2 A

Maximum Drain Current (ID):

4.9 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ZXMN3A06DN8TA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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