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DMTH10H4M5LPS-13

Diodes Incorporated

DMTH10H4M5LPS-13 by Diodes Incorporated

DMTH10H4M5LPS-13 by Diodes Inc. is a N-channel Power FET with 100V DS breakdown voltage, ideal for switching applications. It features a max pulsed drain current of 400A and an avalanche energy rating of 240mJ, operating in enhancement mode. This small outline package FET has a max power dissipation of 136W and can withstand temperatures up to 175°C.

Median Price

$0.983

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 5,000 parts In-Stock

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$0.983

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$0.983

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Vyrian

USA . 4,954 parts In-Stock

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4,954

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Nova Conductors

Japan . 78 parts In-Stock

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Corohmni

South Africa . 853 parts In-Stock

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$1.429

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853

$1.429

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Microchip USA

USA . 2,768 parts In-Stock

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$6.160

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AZTECH Wire

Italy . 1,091 parts In-Stock

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$15.280

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$15.280

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Ampacity Inc.

Singapore . 348 parts In-Stock

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$43.050

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348

$43.050

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Continental Prestige Electronics

USA . 3,933 parts In-Stock

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Eastek

USA . 2,500 parts In-Stock

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$1.410

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Argo Parts USA

USA . 2,397 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Overview

Unlock powerful performance and efficiency with the DMTH10H4M5LPS-13 by Diodes Incorporated. As a leader in semiconductor technology, Diodes Incorporated delivers top-notch quality in Power Field Effect Transistors (FET). Ideal for switching applications, this N-channel transistor offers enhanced mode operation with a built-in diode for added convenience. With a maximum drain current of 100A and a minimum breakdown voltage of 100V, this transistor provides reliable performance in a compact and durable package. Experience seamless functionality and superior power management with the DMTH10H4M5LPS-13 from Diodes Incorporated.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics in terms of power dissipation and switching speed, making this product efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse current flow, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high performance and efficiency in controlling power flow.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and efficiency in switching applications, making this product a reliable choice for power management.

Maximum Drain-Source On Resistance: 0.043 ohm

With a low drain-source on resistance, this FET can efficiently handle larger currents and reduce power losses, making it ideal for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) DMTH10H4M5LPS-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25.5 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMTH10H4M5LPS-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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