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DMN1019USN-13

Diodes Incorporated

DMN1019USN-13 by Diodes Incorporated

DMN1019USN-13 by Diodes Inc. is a N-channel Power FET with 12V DS breakdown voltage and 70A pulsed drain current, ideal for switching applications. It features a single configuration with built-in diode, small outline package style, and operates in enhancement mode. With -55 to 150 °C operating temperature range, it offers 0.01 ohm max drain-source resistance for efficient performance.

Median Price

$0.431

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 36,716 parts In-Stock

1+ parts

$0.590

100+ parts

$0.233

1k+ parts

$0.142

10k+ parts

-

36,716

$0.590

$0.233

$0.142

-

DigiKey

USA . 8,383 parts In-Stock

1+ parts

$0.590

100+ parts

$0.233

1k+ parts

$0.157

10k+ parts

$0.111

8,383

$0.590

$0.233

$0.157

$0.111

Newark

USA . 24,257 parts In-Stock

1+ parts

$0.637

100+ parts

$0.312

1k+ parts

$0.203

10k+ parts

-

24,257

$0.637

$0.312

$0.203

-

Verical

USA . 260,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.096

260,000

-

-

-

$0.096

Element14

Singapore . 59,389 parts In-Stock

1+ parts

-

100+ parts

$0.272

1k+ parts

$0.167

10k+ parts

-

59,389

-

$0.272

$0.167

-

Avnet

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

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10,000

-

-

-

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Arrow

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.096

10k+ parts

-

2,740

-

-

$0.096

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.147

100+ parts

-

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-

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300

$0.147

-

-

-

Chip Stock

USA . 102,436 parts In-Stock

1+ parts

-

100+ parts

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102,436

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Vyrian

USA . 65,956 parts In-Stock

1+ parts

-

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65,956

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NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

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10,000

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ComSIT Distribution GmbH

Germany . 5,744 parts In-Stock

1+ parts

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5,744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 65,451 parts In-Stock

1+ parts

$0.082

100+ parts

$0.080

1k+ parts

$0.080

10k+ parts

-

65,451

$0.082

$0.080

$0.080

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$0.147

100+ parts

$0.140

1k+ parts

$0.133

10k+ parts

$0.131

1,000

$0.147

$0.140

$0.133

$0.131

Corohmni

South Africa . 381 parts In-Stock

1+ parts

$0.153

100+ parts

-

1k+ parts

-

10k+ parts

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381

$0.153

-

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.158

100+ parts

$0.150

1k+ parts

$0.150

10k+ parts

-

2,500

$0.158

$0.150

$0.150

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Ampacity Inc.

Singapore . 65,725 parts In-Stock

1+ parts

$0.178

100+ parts

-

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10k+ parts

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65,725

$0.178

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-

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Continental Prestige Electronics

USA . 42,898 parts In-Stock

1+ parts

$0.418

100+ parts

$0.200

1k+ parts

$0.103

10k+ parts

$0.091

42,898

$0.418

$0.200

$0.103

$0.091

Aztec Data Supply Inc.

USA . 3,758 parts In-Stock

1+ parts

$1.090

100+ parts

-

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3,758

$1.090

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Eastek

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Argo Parts USA

USA . 4,261 parts In-Stock

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4,261

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Overview

Enhance your electronic projects with the DMN1019USN-13 by Diodes Incorporated. This high-quality Power FET offers exceptional performance in switching applications, making it the ideal choice for efficient power management. With a maximum drain current of 9.3A and a low on-resistance of just 0.01 ohm, this transistor ensures reliable operation and maximum power dissipation. Trust Diodes Incorporated, a reputable manufacturer known for its innovative technology and superior products, to provide you with the value and benefits you need for your next project. Upgrade your designs with the DMN1019USN-13 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower ON resistance, faster switching speeds, and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simpler circuit designs and enhances the overall efficiency of the switching application.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides reliable and efficient performance in control circuits.

Maximum Pulsed Drain Current (IDM): 70 A

With a high maximum pulsed drain current, this FET can handle heavy loads and transient conditions effectively.

Maximum Power Dissipation (Abs): 1.2 W

The low power dissipation ensures minimal heat generation, improving the overall efficiency and reliability of the FET.

Maximum Operating Temperature: 150 °C

This FET can operate efficiently at high temperatures, making it suitable for applications where temperature fluctuations are present.

Maximum Drain Current (ID): 9.3 A

With a high maximum drain current rating, this FET can handle substantial current loads, ensuring reliable performance in demanding applications.

Maximum Drain-Source On Resistance: 0.01 ohm

The low ON resistance of this FET results in reduced power loss and improved efficiency in switching operations.

Technical Specifications

Power Field Effect Transistors (FET) DMN1019USN-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

9.3 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

375 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

70 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN1019USN-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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