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DMN10H100SK3-13

Diodes Incorporated

DMN10H100SK3-13 by Diodes Incorporated

DMN10H100SK3-13 by Diodes Incorporated is a N-CHANNEL FET with 100V DS Breakdown Voltage, 16A IDM, and 0.08 ohm RDS(ON). Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Suitable for surface mount with GULL WING terminals in a RECTANGULAR package.

Median Price

$0.696

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,488 parts In-Stock

1+ parts

$0.696

100+ parts

$0.363

1k+ parts

$0.258

10k+ parts

$0.213

2,488

$0.696

$0.363

$0.258

$0.213

DigiKey

USA . 6,388 parts In-Stock

1+ parts

$1.170

100+ parts

$0.482

1k+ parts

$0.339

10k+ parts

$0.258

6,388

$1.170

$0.482

$0.339

$0.258

Mouser Electronics

USA . 2,400 parts In-Stock

1+ parts

$1.170

100+ parts

$0.482

1k+ parts

$0.339

10k+ parts

$0.285

2,400

$1.170

$0.482

$0.339

$0.285

Newark

USA . 1,562 parts In-Stock

1+ parts

$1.280

100+ parts

$0.593

1k+ parts

$0.450

10k+ parts

-

1,562

$1.280

$0.593

$0.450

-

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.238

5,000

-

-

-

$0.238

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.238

5,000

-

-

-

$0.238

Element14

Singapore . 2,488 parts In-Stock

1+ parts

-

100+ parts

$0.616

1k+ parts

$0.439

10k+ parts

$0.418

2,488

-

$0.616

$0.439

$0.418

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.335

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.335

-

-

-

NAC Semi

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.274

70,000

-

-

-

$0.274

Vyrian

USA . 2,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,047 parts In-Stock

1+ parts

$0.212

100+ parts

-

1k+ parts

-

10k+ parts

-

2,047

$0.212

-

-

-

Continental Prestige Electronics

USA . 6,304 parts In-Stock

1+ parts

$0.335

100+ parts

-

1k+ parts

-

10k+ parts

$0.328

6,304

$0.335

-

-

$0.328

Argo Parts USA

USA . 1,979 parts In-Stock

1+ parts

$0.335

100+ parts

-

1k+ parts

-

10k+ parts

$0.325

1,979

$0.335

-

-

$0.325

Corohmni

South Africa . 814 parts In-Stock

1+ parts

$0.352

100+ parts

-

1k+ parts

-

10k+ parts

-

814

$0.352

-

-

-

Semicontronic

India . 2,243 parts In-Stock

1+ parts

$0.461

100+ parts

$0.449

1k+ parts

$0.447

10k+ parts

-

2,243

$0.461

$0.449

$0.447

-

Aztec Data Supply Inc.

USA . 1,914 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,914

$1.890

-

-

-

Eastek

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Overview

Experience superior performance and reliability with the DMN10H100SK3-13 by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-notch power field effect transistors that are perfect for a wide range of switching applications. With a minimum DS breakdown voltage of 100V and a maximum pulsed drain current of 16A, this N-channel transistor offers unparalleled efficiency and durability. Say goodbye to frequent replacements and hello to seamless operations with the DMN10H100SK3-13. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient circuit design and protection against reverse current, enhancing the product's reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and reliable performance in controlling power flow.

Surface Mount: YES

Surface mount technology allows for easy and space-saving installation on circuit boards, making this product suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage of 100V ensures that the FET can handle high voltage applications, providing better protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape offers versatility in mounting options and space utilization, making it suitable for various design configurations.

Terminal Form: GULL WING

The gull-wing terminal form provides easy soldering and secure connection, ensuring reliable performance in operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low on-resistance, making them ideal for high-performance switching applications.

Maximum Pulsed Drain Current (IDM): 16 A

The high pulsed drain current rating of 16A allows the FET to handle high current surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 32.6 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes, providing improved reliability in harsh operating conditions.

No. of Terminals: 2

With only 2 terminals, the FET is easy to integrate into circuit designs, simplifying the overall system architecture.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on a PCB and allows for high-density mounting, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency, low power consumption, and fast switching speeds, making this FET a reliable choice for power management applications.

Transistor Element Material: SILICON

Silicon-based FETs are known for their high performance, reliability, and durability, ensuring long-term stability in electronic circuits.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring a strong and reliable connection in various operating environments.

Maximum Drain Current (ID): 14 A

With a high maximum drain current rating of 14A, this FET can handle high power loads, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.08 ohm

The low on-resistance of 0.08 ohm reduces power losses and improves efficiency in power switching applications, making this FET an ideal choice for high-performance circuits.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and integration, making it easy to use in various electronic devices and applications.

Case Connection: DRAIN

The drain case connection offers easy mounting and heat dissipation, ensuring reliability and performance in demanding operating conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during assembly processes, providing a secure connection for long-term performance.

Technical Specifications

Power Field Effect Transistors (FET) DMN10H100SK3-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

32.6 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

16 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN10H100SK3-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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