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DMC10H172SSD-13

Diodes Incorporated

DMC10H172SSD-13 by Diodes Incorporated

DMC10H172SSD-13 by Diodes Inc. is a Power FET with N/P-channel, 2 elements, built-in diode for switching applications. Features include 100V DS breakdown voltage, 16A pulsed drain current, and 0.16 ohm max on-resistance. Suitable for small outline packages in MOSFET technology with -55 to 150°C operating range.

Median Price

$0.732

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,405 parts In-Stock

1+ parts

$1.240

100+ parts

$0.505

1k+ parts

$0.348

10k+ parts

$0.260

2,405

$1.240

$0.505

$0.348

$0.260

Verical

USA . 5,000 parts In-Stock

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$0.223

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$0.223

Avnet

USA . 2,500 parts In-Stock

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2,500

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Vyrian

USA . 4,675 parts In-Stock

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4,675

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NAC Semi

USA . 2,500 parts In-Stock

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2,500

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Chip Stock

USA . 225 parts In-Stock

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225

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 3,300 parts In-Stock

1+ parts

$0.190

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3,300

$0.190

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Corohmni

South Africa . 857 parts In-Stock

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$1.039

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857

$1.039

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Modulus Dynamics

Lithuania . 13,478 parts In-Stock

1+ parts

$1.826

100+ parts

$1.826

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$1.826

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13,478

$1.826

$1.826

$1.826

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AZTECH Wire

Italy . 852 parts In-Stock

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$9.370

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Argo Parts USA

USA . 4,641 parts In-Stock

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Continental Prestige Electronics

USA . 3,140 parts In-Stock

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Eastek

USA . 2,500 parts In-Stock

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$0.290

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2,500

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$0.290

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Discover the power of innovation with the DMC10H172SSD-13 by Diodes Incorporated. With a reputation for high-quality components, Diodes Incorporated delivers cutting-edge Power Field Effect Transistors (FET) like no other. Ideal for switching applications, this transistor boasts separate N-channel and P-channel elements with built-in diode, providing unmatched efficiency and reliability. Whether you're looking to enhance your electronics or boost performance, this transistor is the perfect solution. Upgrade your technology with Diodes Incorporated today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures that the package is lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types provides versatility in circuit design and allows for more options in switching applications.

Minimum DS Breakdown Voltage: 100 V

The high minimum breakdown voltage of 100V makes this FET suitable for high voltage applications, ensuring reliable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and faster switching speeds, making the FET efficient and responsive in use.

Maximum Pulsed Drain Current (IDM): 16 A

The high maximum pulsed drain current of 16A enables the FET to handle high current spikes and sudden surges without damage, ensuring reliable operation.

Maximum Power Dissipation (Abs): 1.5 W

With a maximum power dissipation of 1.5W, this FET can efficiently handle power dissipation without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the FET to operate in a wide range of temperature conditions, making it suitable for various environments.

Maximum Drain-Source On Resistance: 0.16 ohm

The low maximum drain-source on resistance of 0.16 ohms ensures efficient conduction and minimal power loss, making the FET energy-efficient.

Technical Specifications

Power Field Effect Transistors (FET) DMC10H172SSD-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

20 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16 A

Reference Standard:

MIL-STD-202

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMC10H172SSD-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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