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DMC1018UPD-13

Diodes Incorporated

DMC1018UPD-13 by Diodes Incorporated

DMC1018UPD-13 by Diodes Inc. is a Power FET with N/P-channel, 2 separate elements for switching applications. Features include 12V DS breakdown voltage, 13A IDM, and 0.017 ohm RDS(on). Suitable for enhancement mode operation in small outline packages with -55 to 150°C temp range.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,395 parts In-Stock

1+ parts

$1.050

100+ parts

$0.427

1k+ parts

$0.298

10k+ parts

$0.226

2,395

$1.050

$0.427

$0.298

$0.226

Mouser Electronics

USA . 2,045 parts In-Stock

1+ parts

$1.120

100+ parts

$0.457

1k+ parts

$0.320

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$0.244

2,045

$1.120

$0.457

$0.320

$0.244

Verical

USA . 5,000 parts In-Stock

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$0.239

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$0.239

Avnet

USA . 2,500 parts In-Stock

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2,500

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Chip Stock

USA . 18,500 parts In-Stock

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NAC Semi

USA . 2,500 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,224 parts In-Stock

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$0.181

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$0.181

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Corohmni

South Africa . 248 parts In-Stock

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$0.519

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248

$0.519

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Modulus Dynamics

Lithuania . 23,718 parts In-Stock

1+ parts

$1.865

100+ parts

$1.865

1k+ parts

$1.865

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23,718

$1.865

$1.865

$1.865

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RC Electronics

USA . 45,000 parts In-Stock

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Argo Parts USA

USA . 5,255 parts In-Stock

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Eastek

USA . 2,500 parts In-Stock

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$0.290

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$0.290

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Continental Prestige Electronics

USA . 2,283 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unlock the power of efficient switching with the DMC1018UPD-13 by Diodes Incorporated. As a leading manufacturer in the field of Power Field Effect Transistors, Diodes Incorporated delivers top-quality products that meet industry standards. This transistor's N-CHANNEL AND P-CHANNEL configuration offers versatility in various applications, making it a valuable component for your projects. With a high maximum pulsed drain current of 13A and low on-resistance, this transistor provides optimal performance and reliability. Experience seamless operation and enhanced efficiency with the DMC1018UPD-13, a must-have component for your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good thermal conductivity and electrical insulation, making the product durable and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in various circuit designs.

Maximum Drain-Source On Resistance: 0.017 ohm

Low on-resistance results in minimal power loss and high efficiency during operation.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, suitable for demanding industrial environments.

Avalanche Energy Rating (EAS): 25 mJ

High avalanche energy rating ensures the product can handle transient voltage spikes without damage.

Reference Standard: AEC-Q101

Compliance with automotive industry quality standard ensures reliability and performance consistency.

Technical Specifications

Power Field Effect Transistors (FET) DMC1018UPD-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

25 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

9.5 A

Maximum Drain Current (ID):

9.5 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

13 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMC1018UPD-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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