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APX81146UG-7

Diodes Incorporated

APX81146UG-7 by Diodes Incorporated

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: VSOP; Package Shape: RECTANGULAR;

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,746 parts In-Stock

1+ parts

$0.330

100+ parts

$0.175

1k+ parts

$0.147

10k+ parts

$0.129

5,746

$0.330

$0.175

$0.147

$0.129

DigiKey

USA . 3,910 parts In-Stock

1+ parts

$0.330

100+ parts

$0.174

1k+ parts

$0.146

10k+ parts

$0.132

3,910

$0.330

$0.174

$0.146

$0.132

Newark

USA . 2,665 parts In-Stock

1+ parts

$0.330

100+ parts

$0.176

1k+ parts

$0.146

10k+ parts

-

2,665

$0.330

$0.176

$0.146

-

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.118

15,000

-

-

-

$0.118

Element14

Singapore . 2,895 parts In-Stock

1+ parts

-

100+ parts

$0.339

1k+ parts

$0.264

10k+ parts

$0.220

2,895

-

$0.339

$0.264

$0.220

Farnell

UK . 2,745 parts In-Stock

1+ parts

-

100+ parts

$0.196

1k+ parts

$0.131

10k+ parts

-

2,745

-

$0.196

$0.131

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 2,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,319

-

-

-

-

Bristol Electronics

USA . 2,319 parts In-Stock

1+ parts

-

100+ parts

$0.373

1k+ parts

$0.149

10k+ parts

-

2,319

-

$0.373

$0.149

-

Dan-Mar Components

USA . 2,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,319

-

-

-

-

Sea View Technologies

USA . 1,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,588

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Perfect Parts

USA . 26,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,578

-

-

-

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

Kepictronics

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Native Components

USA . 919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.144

10k+ parts

-

919

-

-

$4.144

-

Northwest PG Solutions

USA . 77 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.187

10k+ parts

-

77

-

-

$4.187

-

Technical Specifications

Microprocessors APX81146UG-7 attributes and parameters. Explore more Microprocessors devices from Diodes Incorporated

Specs

Address Bus Width:

0

Boundary Scan:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2.9 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.3 mm

Peripheral IC Type:

Trade Compliance

APX81146UG-7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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