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APX81123UG-7

Diodes Incorporated

APX81123UG-7 by Diodes Incorporated

APX81123UG-7 by Diodes Inc. is a small outline microprocessor with 4 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.1V to 5.5V and uses CMOS technology. Ideal for industrial applications requiring compact design and high temperature tolerance.

Median Price

$0.335

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,545 parts In-Stock

1+ parts

$0.330

100+ parts

$0.175

1k+ parts

$0.147

10k+ parts

-

2,545

$0.330

$0.175

$0.147

-

Mouser Electronics

USA . 2,795 parts In-Stock

1+ parts

$0.750

100+ parts

$0.283

1k+ parts

$0.189

10k+ parts

$0.128

2,795

$0.750

$0.283

$0.189

$0.128

DigiKey

USA . 2,200 parts In-Stock

1+ parts

$0.750

100+ parts

$0.282

1k+ parts

$0.189

10k+ parts

$0.138

2,200

$0.750

$0.282

$0.189

$0.138

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.118

15,000

-

-

-

$0.118

Farnell

UK . 2,545 parts In-Stock

1+ parts

-

100+ parts

$0.200

1k+ parts

$0.148

10k+ parts

$0.109

2,545

-

$0.200

$0.148

$0.109

Element14

Singapore . 2,545 parts In-Stock

1+ parts

-

100+ parts

$0.340

1k+ parts

$0.217

10k+ parts

-

2,545

-

$0.340

$0.217

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rutronik

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.130

3,000

-

-

-

$0.130

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,269 parts In-Stock

1+ parts

$0.100

100+ parts

-

1k+ parts

-

10k+ parts

-

4,269

$0.100

-

-

-

Component Stockers USA

USA . 21,428 parts In-Stock

1+ parts

$0.390

100+ parts

$0.240

1k+ parts

$0.160

10k+ parts

-

21,428

$0.390

$0.240

$0.160

-

Perfect Parts

USA . 10,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,080

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Glotronic Ltd.

UK . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Northwest PG Solutions

USA . 2,179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,179

-

-

-

-

Native Components

USA . 680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

680

-

-

-

-

Overview

Upgrade your microprocessor experience with the APX81123UG-7 by Diodes Incorporated. Renowned for their high-quality products, Diodes Incorporated delivers cutting-edge solutions for a wide range of applications. This small outline package offers customers maximum supply voltage of 5.5V and a minimum operating temperature of -40°C, making it perfect for industrial settings. With its matte tin terminal finish and gull wing terminal form, this microprocessor provides unmatched reliability and performance. Trust Diodes Incorporated to provide you with top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides durability and protection for the microprocessor, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape enables efficient placement of the microprocessor on circuit boards, optimizing space usage and improving overall design aesthetics.

No. of Terminals: 4

Having a low number of terminals simplifies installation and reduces the risk of errors during assembly, making the microprocessor user-friendly.

Minimum Supply Voltage: 1.1 V

Low minimum supply voltage enables energy-efficient operation and ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability under varying environmental conditions, making the microprocessor suitable for industrial use.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in extreme cold environments, expanding the microprocessor's range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a strong and reliable connection in circuits.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting orientations and simplifies circuit board layout, enhancing design possibilities.

Maximum Seated Height: 1 mm

Low maximum seated height reduces the overall profile of the microprocessor, allowing for compact and space-saving electronic designs.

Width: 1.3 mm

Narrow width of the microprocessor enables high-density packing on circuit boards, increasing efficiency and saving valuable board space.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures quick and precise soldering process, reducing the risk of heat damage to the microprocessor.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports lead-free soldering process and ensures reliable connection between the microprocessor and circuit board.

Length: 2.9 mm

Compact length of the microprocessor enables efficient use of space on circuit boards, contributing to a more streamlined and optimized system design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the microprocessor can withstand harsh operating conditions and maintain performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR

Designed specifically as a microprocessor, this product offers optimized performance and functionality for processing tasks in electronic devices and systems.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making the microprocessor energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form allows for easier soldering and inspection during assembly, ensuring reliable connections and simplifying the manufacturing process.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with various electronic systems, making the microprocessor versatile in its applications.

Terminal Pitch: 1.778 mm

Optimal terminal pitch facilitates precise mounting and soldering of the microprocessor on circuit boards, ensuring accurate connections and efficient assembly.

Format: FIXED POINT

Fixed point format designates the microprocessor's precision and accuracy in numerical calculations, making it ideal for applications that require exact computations.

Technical Specifications

Microprocessors APX81123UG-7 attributes and parameters. Explore more Microprocessors devices from Diodes Incorporated

Specs

Address Bus Width:

0

Boundary Scan:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2.9 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.3 mm

Peripheral IC Type:

Trade Compliance

APX81123UG-7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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