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AP9101CAK6-BVTRG1

Diodes Incorporated

AP9101CAK6-BVTRG1 by Diodes Incorporated

Diodes Inc.'s AP9101CAK6-BVTRG1 is a Power Management IC with 3.5V Nominal Voltage, -40 to 85°C Operating Temperature Range, and 6 Terminals in a Small Outline Package. Ideal for industrial applications requiring power supply support circuits, this IC has a compact design with surface mount capability and dual terminal position.

Median Price

$0.077

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 143,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.077

143,000

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-

$0.077

Verical

USA . 143,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.077

10k+ parts

-

143,000

-

-

$0.077

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

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26

$0.144

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Vyrian

USA . 6,088 parts In-Stock

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-

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6,088

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VNN

France . 1,098 parts In-Stock

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1,098

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 143,787 parts In-Stock

1+ parts

$0.101

100+ parts

-

1k+ parts

-

10k+ parts

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143,787

$0.101

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-

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Continental Prestige Electronics

USA . 6,640 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

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10k+ parts

$0.141

6,640

$0.144

-

-

$0.141

Argo Parts USA

USA . 1,207 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

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10k+ parts

$0.139

1,207

$0.144

-

-

$0.139

AZTECH Wire

Italy . 921 parts In-Stock

1+ parts

$9.480

100+ parts

-

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921

$9.480

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$18.460

100+ parts

$16.799

1k+ parts

$15.137

10k+ parts

-

2,000

$18.460

$16.799

$15.137

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Corohmni

South Africa . 646 parts In-Stock

1+ parts

$22.402

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646

$22.402

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Microchip USA

USA . 278 parts In-Stock

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278

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$0.141

1k+ parts

$0.136

10k+ parts

$0.134

100

-

$0.141

$0.136

$0.134

Overview

Enhance your power management system with the AP9101CAK6-BVTRG1 by Diodes Incorporated. Known for their top-notch quality and reliability, Diodes Incorporated delivers exceptional power management ICs like no other. Designed to optimize performance and efficiency, this small outline, thin profile package is perfect for various industrial applications. With a wide operating temperature range and dual terminals for easy installation, this IC offers unmatched value and benefits to customers looking for a reliable power supply support circuit. Upgrade your system today with Diodes Incorporated.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology makes it easy to integrate this IC into circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3.5 V

The nominal supply voltage of 3.5 V is within the common range for many electronic devices, ensuring compatibility with a variety of applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40°C to 85°C allows this IC to function effectively in extreme environmental conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can handle high temperatures without performance degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC efficient and reliable for power management applications.

Technical Specifications

Power Management ICs AP9101CAK6-BVTRG1 attributes and parameters. Explore more Power Management ICs devices from Diodes Incorporated

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

AP9101CAK6-BVTRG1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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