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CY8C20160-LDX2I

Cypress Semiconductor

CY8C20160-LDX2I by Cypress Semiconductor

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: VQCCN; Package Shape: SQUARE; Width: 3 mm;

Median Price

$1.570

Lifecycle Status

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1

In-Stock Inventory

< 1k

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USA . 92 parts In-Stock

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100+ parts

$1.570

1k+ parts

$1.300

10k+ parts

$1.160

92

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$1.570

$1.300

$1.160

Distributors (Availability)

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Component Stockers USA

USA . 57 parts In-Stock

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57

$1.300

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Perfect Parts

USA . 1,322 parts In-Stock

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100+ parts

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1,322

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Microchip USA

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295

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Technical Specifications

Other Function Memory ICs CY8C20160-LDX2I attributes and parameters. Explore more Other Function Memory ICs devices from Cypress Semiconductor

Specs

Additional Features:

SRAM IS ORGANISED AS 512MB

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX1

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3 mm

Trade Compliance

CY8C20160-LDX2I Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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