Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CY39200V388-125MGC by Cypress Semiconductor is a 3072 macrocell LOADABLE PLD with 10ns propagation delay. It operates at 2.5V, has 294 I/O lines, and supports JTAG boundary scan test. Ideal for applications requiring fast processing and extensive I/O capabilities in commercial temperature environments.
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Aranea Global
PLASTIC/EPOXY material makes the package durable and lightweight, ideal for electronic components in various applications.
A low propagation delay of 10 ns ensures fast processing and response times within the device.
Surface-mount capability allows for easy and efficient integration onto circuit boards, saving space and reducing assembly complexity.
A maximum supply voltage of 2.7 V ensures compatibility with a wide range of systems and power sources.
With 3072 macro cells, this PLD offers a high level of programmability and flexibility for complex logic functions and designs.
CMOS technology ensures low power consumption and high noise immunity for reliable operation in various environments.
The square package shape allows for efficient use of board space and easy placement alongside other components.
Ball terminals provide a reliable and secure connection to the circuit board, ensuring stable performance over time.
A nominal supply voltage of 2.5 V offers a balanced level of power for consistent and reliable operation.
Support for multiple power supply voltages gives flexibility in integrating the device into different systems with varying power requirements.
With 388 terminals, this PLD offers ample connectivity options for interfacing with other components and systems.
A loadable PLD allows for easy reprogramming and updating of logic functions, making it versatile for evolving project needs.
The grid array package style provides a compact and organized layout for efficient placement and routing on the circuit board.
In-system programmability allows for convenient updates and modifications to the device without the need for physical reconfiguration or replacement.
Macrocell output functionality enables the device to perform complex logic operations, making it suitable for a wide range of applications.
A minimum supply voltage of 2.3 V ensures reliable operation even at lower power levels, increasing the device's versatility.
With a maximum operating temperature of 70°C, this PLD can withstand a range of environmental conditions without compromising performance.
A terminal pitch of 1.27 mm provides a good balance between compact design and ease of soldering during assembly.
Having 0 dedicated inputs and 294 I/O lines offers flexibility in configuring the device for input/output operations tailored to specific project requirements.
The ability to operate at a minimum temperature of 0°C allows for reliable performance even in colder environments.
The use of tin-lead finishing on the terminals ensures good solderability and durability for long-lasting connections.
Bottom terminal positioning simplifies board layout and routing for efficient integration into the overall circuit design.
A maximum seated height of 2.46 mm enables a compact and low-profile design for space-constrained applications.
A width of 35 mm provides a good balance between space efficiency and ease of handling during installation and maintenance.
The 35 mm length offers a standardized form factor suitable for various mounting configurations and board layouts.
Support for JTAG boundary scan testing enables easy and comprehensive debugging and testing of the device for improved reliability and performance.
Having 294 I/O lines allows for versatile connectivity and compatibility with a wide range of external devices and interfaces.
Commercial-grade temperature grading ensures reliable operation in standard operating conditions typically found in commercial applications.
Programmable Logic Devices (PLD) CY39200V388-125MGC attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Cypress Semiconductor
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CY39200V388-125MGC Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.
2N2222A
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
EU2B-YS303C
Idec
ROTARY SWITCH;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
Crimson Semiconductor
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Tesla Elektronicke Soucastky
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
Alpha & Omega Semiconductor
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
BSS123,215
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
PEEL18CV8P-15L
Diodes Inc. PEEL18CV8P-15L is a PLD with 15ns propagation delay, 5.25V max supply voltage, and CMOS technology. Ideal for PAL-type applications, it offers 74 product terms, 41.6MHz clock frequency, and operates b/w 0-70°C.
EPM7128BTC100-4N
Intel
EPM7128BTC100-4N by Intel is a 128 macrocell EE PLD with 84 I/O lines, operating at up to 243.9 MHz clock frequency. It has a propagation delay of 4 ns and can be used for in-system programmable applications requiring low profile, fine pitch packaging.
EPM240T100I3
The Intel EPM240T100I3 is a FLASH PLD with 192 macro cells, 80 inputs/outputs, and 4.7 ns propagation delay. Ideal for applications requiring high-speed processing and programmable logic in a compact form factor. Suitable for use in various electronic systems due to its versatile features and surface-mount package style.
ATF16V8CZ-15XU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
XC2C256-7TQG144I
Xilinx
XC2C256-7TQG144I by Xilinx is a 256 macrocell FLASH PLD with 118 I/O lines, operating at max 108 MHz. It features a propagation delay of 7.5 ns and can handle a max supply voltage of 1.9 V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in compact spaces due to its low profile flatpack design.
5M570ZT144I5N
Altera
The Altera 5M570ZT144I5N is a programmable logic device (PLD) with 440 macro cells. It has a maximum clock frequency of 118.3 MHz and a propagation delay of 17.7 ns. This PLD is surface mountable and can operate at temperatures ranging from -40 to 100 degrees Celsius. It is suitable for industrial applications requiring a compact form factor and in-system programmability.
ATF22V10CQZ-20SU
Microchip Technology
ATF22V10CQZ-20SU by Microchip Technology is a 5.5V CMOS PLD with 20ns propagation delay, suitable for industrial applications. Featuring 22 inputs and 10 I/O lines, it offers a clock frequency of up to 38.5MHz in a small outline package style for efficient integration into electronic systems.
EPM240ZM100C6N
Intel's EPM240ZM100C6N is a 192 macrocell FLASH PLD with 80 inputs/outputs, 7.9 ns propagation delay, and operates at temperatures up to 85°C. Ideal for applications requiring in-system programmability, it features a grid array package with 0.5 mm terminal pitch and JTAG boundary scan test capability.
ATF22V10CQZ-20PC
ATF22V10CQZ-20PC by Microchip Technology is a 5.25V CMOS PLD with 20ns propagation delay, ideal for applications requiring FLASH PLD technology. Featuring 11 dedicated inputs and 10 I/O lines, this rectangular IN-LINE package has a clock frequency of up to 38.5 MHz, making it suitable for commercial use in various electronic systems.
ATF22V10C-10XU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
XC95144XL-7TQG100I
Xilinx XC95144XL-7TQG100I is a 144 macrocell FLASH PLD with 81 I/O lines, operating at max 138.88 MHz clock frequency. It has a propagation delay of 7.5 ns and supports JTAG boundary scan test. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.
LC4256V-75TN100E
Lattice Semiconductor
LC4256V-75TN100E by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay, 74 inputs, and 64 I/O lines. It operates at a max clock frequency of 111 MHz and is in-system programmable for applications requiring high-speed processing and flexibility in automotive environments.
ATF1504AS-10AU44-T
Microchip Technology's ATF1504AS-10AU44-T is a 32 I/O EE PLD with 10 ns propagation delay and 125 MHz clock frequency. Ideal for industrial applications, this PLD features a max supply voltage of 5.5 V and operates in temperatures ranging from -40 to 85 °C.
XC95144XL-10TQ100I
The Xilinx XC95144XL-10TQ100I is a 144 macrocell FLASH PLD with 81 I/O lines, operating at a max clock frequency of 81.3 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.
5M40ZM64I5N
Intel's 5M40ZM64I5N is a FLASH PLD with 30 I/O lines, 118.3 MHz clock frequency, and 14 ns propagation delay. Ideal for industrial applications requiring programmable logic devices in a compact square package with fine pitch grid array style.
ATF750CL-15XU
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
EPM240T100I5N
EPM240T100I5N by Intel is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. It is used for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and JTAG boundary scan test capability.
EPM1270T144I5N
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Finishing Of Terminal Used: MATTE TIN;
EP1K50TI144-2
The Altera EP1K50TI144-2 is a programmable logic device with 2880 logic cells. It has a propagation delay of 0.4 ns and can support up to 102 inputs and outputs. This PLD has a maximum clock frequency of 37.5 MHz and operates at industrial-grade temperatures. Its application includes mixed output functions in various industries.
5M2210ZF256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
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CY39100V388B-125MGC
Cypress Semiconductor
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
CY39100V208B-200NTC
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
CY39100V256B-83BBC
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
CY39165Z208-83NTI
Infineon Technologies
Programmable Logic Devices;
CY39165Z208-125NTC
CY39165Z208-83NTC
CY39165Z208-125NTI
CY39200V208-125NTC
CY39200V388-125MGI
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
CY39200V388-167MGC
CY39200V388-83MGC
CY39200V388-83MGI
CY39200V484-125BBC
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
CY39200V484-125BBI
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
CY39200V484-83BBC
CY39200V484-83BBI
CY39200V676-125MBC
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: LBGA; Package Shape: SQUARE;
CY39200V208-181NTC
CY39200V388-181MGC
CY39200V484-181BBC
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