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MAX14980ETO+

Analog Devices

MAX14980ETO+ by Analog Devices

MAX14980ETO+ by Analog Devices is a 42-terminal analog data transmission interface with 3.3V supply voltage and BICMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications like line equalizers in telecom systems. The chip carrier package has a compact size of 9x3.5mm and low power consumption of 0.44mA at max supply current.

Median Price

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6

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1k+

MAX14980ETO+ by Analog Devices
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Analog Devices Inc

USA . 162 parts In-Stock

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Vyrian

USA . 4,820 parts In-Stock

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4,820

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Digiode

USA . 3,056 parts In-Stock

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Anansix

USA . 1,945 parts In-Stock

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Inventory MP

USA . 10 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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10

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MARBEL Systems

Belgium . 5,738 parts In-Stock

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$6.879

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$6.879

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Texas Native Microelectronics

USA . 450 parts In-Stock

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$7.907

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$7.591

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$7.354

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$6.958

450

$7.907

$7.591

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$6.958

Kenton Components

USA . 3,894 parts In-Stock

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$9.488

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$8.350

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$9.488

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$8.350

Qasali Group International

UK . 200 parts In-Stock

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$21.349

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$19.854

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$18.787

200

$21.349

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$18.787

Component Stockers USA

USA . 325 parts In-Stock

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$99.990

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325

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Semicontronic

India . 680 parts In-Stock

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$1,000.000

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$975.000

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$970.000

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680

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Corphita

USA . 1,285 parts In-Stock

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Microchip USA

USA . 1,275 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

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Overview

Enhance your analog data transmission systems with the MAX14980ETO+ by Analog Devices. Trusted for its quality and reliability, Analog Devices is a leader in innovative solutions for various industries. This surface-mountable device offers a compact design and operates at industrial temperatures, making it suitable for a wide range of applications. With a nominal supply voltage of 3.3V and low supply current, this line equalizer provides exceptional value and performance to meet your communication needs. Upgrade your systems today with Analog Devices' MAX14980ETO+.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, making it ideal for applications with limited space.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V makes this product compatible with a wide range of systems and devices.

No. of Terminals: 42

Having 42 terminals allows for versatile connectivity options and enables the product to support complex data transmission requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal performance, reliability, and overall efficiency of the product.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can withstand extreme cold conditions, enhancing its versatility for different environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and conductivity, ensuring reliable connections for seamless data transmission.

Terminal Position: QUAD

The quad terminal position facilitates easy installation and maintenance, improving the overall usability of the product.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this product offers a low profile design, making it suitable for applications where space constraints are a concern.

Width: 3.5 mm

The compact width of 3.5mm ensures the product can fit into smaller spaces without sacrificing functionality.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for up to 30 seconds, making it durable and reliable during soldering processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product is suitable for lead-free soldering processes, ensuring compliance with industry standards.

Length: 9 mm

The 9mm length provides a balance between compactness and functionality, making it versatile for a variety of applications.

Temperature Grade: INDUSTRIAL

Being industrial-grade, this product can withstand harsh environmental conditions and high temperatures, making it reliable for industrial applications.

Technology: BICMOS

Using BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption in data transmission.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with regulations, making it a sustainable choice for electronic devices.

Maximum Supply Current: 0.44 mA

With a maximum supply current of 0.44mA, this product offers energy efficiency and reduces power consumption, ideal for battery-powered applications.

Telecom IC Type: LINE EQUALIZER

Designed as a line equalizer, this product ensures the integrity and quality of data transmission over long distances, making it ideal for telecom applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and makes it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides precise and secure connections, reducing the risk of signal interference and enhancing the overall performance of the product.

Technical Specifications

Analog Data Transmission Interfaces MAX14980ETO+ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Analog Devices

Specs

JESD-30 Code:

R-XQCC-N42

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC42,.14X.35,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.44 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

MAX14980ETO+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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