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HMC245QS16

Analog Devices

HMC245QS16 by Analog Devices

HMC245QS16 by Analog Devices is a SP3T RF/Microwave switch with 26.99 dBm CW input power and 1 dB max insertion loss. It operates from -40 to 85 °C, has 16 terminals, and supports frequencies up to 3500 MHz. Ideal for applications requiring high-frequency switching in components like amplifiers or filters.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 6,718 parts In-Stock

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Digiode

USA . 185 parts In-Stock

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Sunrise Surplus Inc.

USA . 67 parts In-Stock

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Semtec, LLC

USA . 3 parts In-Stock

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Semi Source

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Parana Technologies

USA . 4,119 parts In-Stock

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$2.102

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$1.955

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IDEA Electronic Components Group

UK . 1,809 parts In-Stock

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$2.260

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$2.147

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DigiPath Technology Company

USA . 1,302 parts In-Stock

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$3.526

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$3.385

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One Stop Electronics

USA . 719 parts In-Stock

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$9.000

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Semicontronic

India . 564 parts In-Stock

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$12.000

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$11.700

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$11.640

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AZTECH Wire

Italy . 820 parts In-Stock

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$19.215

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Kepictronics

USA . 3,700 parts In-Stock

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Assy Fe

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Corphita

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Overview

Experience the superior performance and reliability of the HMC245QS16 RF/Microwave Switch by Analog Devices. With a maximum insertion loss of just 1 dB and minimum isolation of 26 dB, this component offers unparalleled quality for your applications. Whether you're working in telecommunications, aerospace, or defense, this SP3T switch is the ideal solution for your needs. Trust Analog Devices, a leading manufacturer in the industry, to deliver cutting-edge technology that exceeds your expectations. Unlock the value and benefits of the HMC245QS16 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal properties and durability, making it suitable for various environmental conditions.

Maximum Input Power (CW): 26.99 dBm

High maximum input power handling capability ensures reliable performance in high power RF/microwave applications.

Compression Point (1 dB): 26 dBm

High compression point indicates minimal signal distortion even at high power levels.

Construction: COMPONENT

Component-based construction allows for easy integration into existing systems or circuit boards.

Power Supplies (V): 5

Low power supply requirement makes it energy-efficient and cost-effective to operate.

No. of Terminals: 16

Multiple terminals provide versatility in connectivity options for different system configurations.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability in various operating environments.

Minimum Operating Temperature: -40 °C

Suitable for both low and high-temperature environments, increasing the product's adaptability.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish offers good solderability and conductivity for reliable connections.

Maximum Insertion Loss: 1 dB

Low insertion loss ensures minimal signal attenuation for efficient RF/microwave signal transmission.

Nominal On Time: 0.15 us

Fast switching speed allows for quick signal routing, suitable for time-sensitive applications.

Technology: GAAS

Gallium arsenide technology offers high-frequency performance and reliability in RF/microwave applications.

RF or Microwave Device Type: SP3T

SP3T configuration provides multiple signal routing options for flexibility in system design.

Characteristic Impedance: 50 ohm

Standard 50 ohm impedance ensures compatibility with a wide range of RF/microwave components and systems.

Minimum Isolation: 26 dB

High isolation prevents signal interference and crosstalk, maintaining signal integrity.

Minimum Operating Frequency: 0 MHz

Wide frequency range allows for versatile use in various RF/microwave applications.

Mounting Feature: SURFACE MOUNT

Surface-mount design enables easy and secure installation on circuit boards, saving space and simplifying assembly.

Maximum Operating Frequency: 3500 MHz

High operating frequency capability makes it suitable for a wide range of RF/microwave signal routing applications.

Port Termination: ABSORPTIVE

Absorptive port termination helps minimize signal reflections and ensures efficient signal transmission.

Technical Specifications

RF/Microwave Switches HMC245QS16 attributes and parameters. Explore more RF/Microwave Switches devices from Analog Devices

Specs

Compression Point (1 dB):

26 dBm

Additional Features:

CMOS/TTL COMPATIBLE

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

26.99 dBm

Maximum Insertion Loss:

1 dB

Minimum Isolation:

26 dB

JESD-609 Code:

e0

Mounting Feature:

No. of Functions:

1

No. of Terminals:

16

Nominal On Time:

.15 us

Maximum Operating Frequency:

3500 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SSOP16,.25

Port Termination:

ABSORPTIVE

Power Supplies (V):

5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Terminal Finish:

Tin/Lead (Sn/Pb)

Trade Compliance

HMC245QS16 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-590-2599, 5962015902599

NIIN

015902599

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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