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LM96530SQX/NOPB

Texas Instruments

LM96530SQX/NOPB by Texas Instruments

LM96530SQX/NOPB by Texas Instruments is a RF/Microwave Switch with 60 terminals, operating at 0-70°C. It has a 5V power supply, matte tin finish, and 2us nominal on time. Ideal for applications requiring a transfer switch in surface mount configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,562 parts In-Stock

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Digiode

USA . 4,698 parts In-Stock

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4,698

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Anansix

USA . 999 parts In-Stock

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999

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Distributors (Availability)

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Parana Technologies

USA . 360 parts In-Stock

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$0.934

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$1.846

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360

$0.934

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$1.846

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ChromeModa Solutions

Germany . 3,229 parts In-Stock

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$1.050

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$0.861

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$1.050

$0.861

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IDEA Electronic Components Group

UK . 1,700 parts In-Stock

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$1.050

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$0.945

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$1.050

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AZTECH Wire

Italy . 674 parts In-Stock

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$12.185

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674

$12.185

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One Stop Electronics

USA . 187 parts In-Stock

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$24.000

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$24.000

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Component Stockers USA

USA . 562 parts In-Stock

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$99.990

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562

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 10,062 parts In-Stock

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Corphita

USA . 5,343 parts In-Stock

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Microchip USA

USA . 4,944 parts In-Stock

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DigiPath Technology Company

USA . 1,316 parts In-Stock

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$0.947

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1,316

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$0.947

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Overview

Enhance your RF and microwave systems with the LM96530SQX/NOPB by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the form of RF/Microwave Switches. This versatile component offers seamless switching capabilities, allowing for efficient signal routing in various applications. With a focus on performance and durability, this product ensures optimal functionality in any setting. Upgrade your systems today and experience the unmatched value and benefits that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the RF/microwave switch lightweight and cost-effective.

Power Supplies (V): 5

Operating at 5 volts makes this RF/microwave switch compatible with standard power supplies, ensuring easy integration into various systems.

No. of Terminals: 60

Having 60 terminals allows for versatile connections and configurations, increasing flexibility in system design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this switch can withstand high temperatures, increasing reliability in harsh environments.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures this switch can function effectively in a wide range of temperature conditions.

Terminal Finish: Matte Tin (Sn)

The use of matte tin finish on terminals provides good solderability and conductivity, enhancing the overall performance of the switch.

Nominal On Time: 2 us

With a nominal on time of 2 microseconds, this switch offers fast switching speeds, making it suitable for high-speed applications.

RF or Microwave Device Type: TRANSFER SWITCH

Being a transfer switch means this product can efficiently transfer signals between different paths, enabling seamless signal routing in RF and microwave systems.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation onto PCBs, simplifying the assembly process and saving space.

Technical Specifications

RF/Microwave Switches LM96530SQX/NOPB attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments

Specs

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

No. of Terminals:

60

Nominal On Time:

2 us

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

Package Equivalence Code:

LCC60,.35SQ,20

Power Supplies (V):

5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Terminal Finish:

Matte Tin (Sn)

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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