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ADG901BCP

Analog Devices

ADG901BCP by Analog Devices

ADG901BCP by Analog Devices is a CMOS RF/Microwave switch with 8 terminals. It offers low insertion loss of 1.25 dB and operates from 0 to 2500 MHz. Ideal for diversity switching applications, it has a max input power of 18.06 dBm and compression point of 20 dBm.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,984 parts In-Stock

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Digiode

USA . 948 parts In-Stock

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948

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Parana Technologies

USA . 1,429 parts In-Stock

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$1.724

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$1.604

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$1.724

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$1.604

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IDEA Electronic Components Group

UK . 1,802 parts In-Stock

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$1.854

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$1.761

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DigiPath Technology Company

USA . 1,181 parts In-Stock

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$2.892

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$2.777

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Northwest PG Solutions

USA . 476 parts In-Stock

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$2.941

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AZTECH Wire

Italy . 521 parts In-Stock

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$10.128

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Semicontronic

India . 1,204 parts In-Stock

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$34.000

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$33.150

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$32.980

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One Stop Electronics

USA . 940 parts In-Stock

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$40.000

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Corphita

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Native Components

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Overview

Elevate your RF/Microwave system with the ADG901BCP by Analog Devices. Crafted with precision and expertise, this diversity switch offers unparalleled quality and reliability. Designed to handle a wide range of frequencies, this component provides seamless performance for various applications. With low insertion loss and high power handling capabilities, customers can trust in the value and benefits that this product brings to their projects. Upgrade your system today with the ADG901BCP and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and light weight, making the product suitable for various applications.

Maximum Input Power (CW): 18.06 dBm

The high maximum input power handling capability ensures reliable performance under various operating conditions.

Compression Point (1 dB): 20 dBm

The high compression point indicates the ability of the switch to maintain linearity at higher power levels, ensuring signal integrity.

Construction: COMPONENT

The component construction provides flexibility in integration and customization for specific RF/microwave system requirements.

Power Supplies (V): 1.8/2.5

The dual power supply options offer compatibility with different voltage requirements, increasing the versatility of the product.

No. of Terminals: 8

The multiple terminals allow for versatile connectivity options, enabling the switch to be used in various network configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability allows the switch to be used in extreme cold environments without compromising performance.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and reliability in electrical connections, ensuring long-term performance.

Maximum Insertion Loss: 1.25 dB

The low insertion loss minimizes signal attenuation and maintains signal integrity, making the switch suitable for high-frequency applications.

Nominal On Time: 0.005 us

The fast nominal on time ensures quick switching speed, reducing signal latency and improving system performance.

Technology: CMOS

The CMOS technology offers low power consumption and high integration capabilities, making the switch energy-efficient and compact.

RF or Microwave Device Type: DIVERSITY SWITCH

The diversity switch allows for seamless switching between multiple RF/microwave signals, enhancing signal reception and transmission in communication systems.

Characteristic Impedance: 50 ohm

The 50 ohm characteristic impedance ensures compatibility with standard RF/microwave components, simplifying system design and integration.

Minimum Operating Frequency: 0 MHz

The ability to operate at 0 MHz frequency allows for versatile use in a wide range of RF/microwave applications, from DC to microwave signals.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies and speeds up the installation process, making the switch suitable for high-volume production.

Maximum Operating Frequency: 2500 MHz

The high maximum operating frequency capability makes the switch suitable for high-frequency RF/microwave applications, ensuring reliable performance.

Port Termination: ABSORPTIVE

The absorptive port termination reduces signal reflections and improves signal quality, making the switch ideal for high-performance RF/microwave systems.

Technical Specifications

RF/Microwave Switches ADG901BCP attributes and parameters. Explore more RF/Microwave Switches devices from Analog Devices

Specs

Compression Point (1 dB):

20 dBm

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

18.06 dBm

Maximum Insertion Loss:

1.25 dB

JESD-609 Code:

e0

Mounting Feature:

No. of Functions:

1

No. of Terminals:

8

Nominal On Time:

.005 us

Maximum Operating Frequency:

2500 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOLCC8,.1,20

Port Termination:

ABSORPTIVE

Power Supplies (V):

1.8/2.5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Terminal Finish:

Tin/Lead (Sn/Pb)

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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