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ADUCM3027BCBZ-RL

Analog Devices

ADUCM3027BCBZ-RL by Analog Devices

Analog Devices' ADUCM3027BCBZ-RL is a 32-bit microcontroller with 131072 ROM words, 65536 RAM bytes, and 4-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers connectivity via I2C, SPI(3), UART and features peripherals like DMA(25) and TIMER(3).

Median Price

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2

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1k+

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Vyrian

USA . 5,344 parts In-Stock

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Digiode

USA . 508 parts In-Stock

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Native Components

USA . 497 parts In-Stock

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$7.250

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Vigor

Singapore . 4,000 parts In-Stock

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$12.270

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$12.270

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AZTECH Wire

Italy . 642 parts In-Stock

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$17.396

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Parana Technologies

USA . 4,243 parts In-Stock

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$27.057

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$25.163

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

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$29.094

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$27.639

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Semicontronic

India . 1,023 parts In-Stock

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$30.000

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$29.250

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$29.100

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One Stop Electronics

USA . 832 parts In-Stock

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$32.000

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DigiPath Technology Company

USA . 4,243 parts In-Stock

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$45.387

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$43.571

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Component Stockers USA

USA . 469 parts In-Stock

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$251.200

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QUARKTWIN TECHNOLOGY LTD

USA . 24,928 parts In-Stock

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Northwest PG Solutions

USA . 1,436 parts In-Stock

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Corphita

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Overview

Discover the cutting-edge ADUCM3027BCBZ-RL microcontroller by Analog Devices, a game-changer in the industry. With advanced technology and high-quality materials, this versatile device offers unmatched performance in a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides seamless connectivity and efficient operation. Experience the value and benefits of Analog Devices' expertise with the ADUCM3027BCBZ-RL, setting new standards in innovation and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for packaging microcontrollers as it provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

Being surface mountable allows for easier integration into electronic circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can support a wide range of applications and power requirements.

Package Shape: SQUARE

A square package shape can be more efficient for layout and placement on a circuit board, maximizing use of available space.

Bit Size: 32

A 32-bit architecture provides high computational power and precision, suitable for complex tasks and calculations.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfers between peripherals and memory without CPU intervention, improving overall system performance.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store a significant amount of program instructions and data, supporting complex applications.

RAM Bytes: 65536

A generous amount of Random Access Memory (RAM) allows for efficient data storage and manipulation during program execution, enhancing performance.

Analog To Digital Convertors: 4-Ch 12-Bit

Having 4 channels of 12-bit ADC enables precise conversion of analog signals to digital data, ideal for sensor interfacing and measurement applications.

Connectivity: I2C, SPI(3), UART

Support for multiple communication protocols like I2C, SPI, and UART facilitates easy integration with various external devices, enhancing connectivity options.

Technical Specifications

Microcontrollers ADUCM3027BCBZ-RL attributes and parameters. Explore more Microcontrollers devices from Analog Devices

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B54

Length:

2.76 mm

No. of I/O Lines:

34

No. of Terminals:

54

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.53 mm

Speed:

26 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.74 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(3), UART

Peripherals:

COMPARATOR, DMA(25), POR, RTC(2), TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

ADUCM3027BCBZ-RL Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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