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ADSP-BF702KCPZ-3

Analog Devices

ADSP-BF702KCPZ-3 by Analog Devices

ADSP-BF702KCPZ-3 by Analog Devices is a 300 MHz DSP with 88 terminals, operating at 1.7-1.9V. Ideal for low power applications, it features a square package style and boundary scan capability. This CMOS technology chip carrier suits commercial-grade digital signal processing needs efficiently.

Median Price

$9.474

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 2,848 parts In-Stock

1+ parts

$8.820

100+ parts

-

1k+ parts

$8.370

10k+ parts

-

2,848

$8.820

-

$8.370

-

Mouser Electronics

USA . 45 parts In-Stock

1+ parts

$20.590

100+ parts

$12.150

1k+ parts

$12.070

10k+ parts

-

45

$20.590

$12.150

$12.070

-

Verical

USA . 2,832 parts In-Stock

1+ parts

-

100+ parts

$9.474

1k+ parts

-

10k+ parts

-

2,832

-

$9.474

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 222 parts In-Stock

1+ parts

$7.201

100+ parts

-

1k+ parts

-

10k+ parts

-

222

$7.201

-

-

-

Vyrian

USA . 4,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,129

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 177 parts In-Stock

1+ parts

$0.087

100+ parts

-

1k+ parts

-

10k+ parts

$0.084

177

$0.087

-

-

$0.084

Northwest PG Solutions

USA . 431 parts In-Stock

1+ parts

$0.096

100+ parts

-

1k+ parts

-

10k+ parts

$0.084

431

$0.096

-

-

$0.084

Semicontronic

India . 1,480 parts In-Stock

1+ parts

$6.440

100+ parts

$6.279

1k+ parts

$6.247

10k+ parts

-

1,480

$6.440

$6.279

$6.247

-

Andel Nordic

Denmark . 1,229 parts In-Stock

1+ parts

$6.530

100+ parts

-

1k+ parts

$4.573

10k+ parts

$4.573

1,229

$6.530

-

$4.573

$4.573

Corphita

USA . 687 parts In-Stock

1+ parts

$6.822

100+ parts

-

1k+ parts

-

10k+ parts

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687

$6.822

-

-

-

Vigor

Singapore . 2,992 parts In-Stock

1+ parts

$11.080

100+ parts

-

1k+ parts

-

10k+ parts

-

2,992

$11.080

-

-

-

Corohmni

South Africa . 250 parts In-Stock

1+ parts

$22.931

100+ parts

-

1k+ parts

-

10k+ parts

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250

$22.931

-

-

-

Parana Technologies

USA . 423 parts In-Stock

1+ parts

$52.144

100+ parts

-

1k+ parts

$48.494

10k+ parts

-

423

$52.144

-

$48.494

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IDEA Electronic Components Group

UK . 1,960 parts In-Stock

1+ parts

$56.069

100+ parts

$53.266

1k+ parts

-

10k+ parts

-

1,960

$56.069

$53.266

-

-

DigiPath Technology Company

USA . 2,829 parts In-Stock

1+ parts

$87.468

100+ parts

$83.969

1k+ parts

-

10k+ parts

$83.969

2,829

$87.468

$83.969

-

$83.969

Overview

Unlock the power of digital signal processing with Analog Devices' ADSP-BF702KCPZ-3. Designed with cutting-edge technology and top-notch quality, this DSP offers unparalleled performance for a wide range of applications. From audio processing to telecommunications, this versatile chip is the perfect solution for enhancing your products. With a low power mode and maximum clock frequency of 300 MHz, this product delivers efficiency and speed like never before. Trust Analog Devices to provide you with the tools you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, making it suitable for mass production and reducing manufacturing costs.

Maximum Supply Voltage: 1.9 V

Operates at a relatively low supply voltage, promoting energy efficiency and extending battery life in portable devices.

Package Shape: SQUARE

Square shape packages offer better thermal dissipation and are more space-efficient on PCBs compared to rectangular or irregular shapes.

No. of Terminals: 88

A higher number of terminals provide more connectivity options and flexibility in designing complex circuits and interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers efficient heat dissipation, space-saving design, and compatibility with slim electronic devices.

Minimum Supply Voltage: 1.7 V

Allows for operation at low power levels, reducing energy consumption and heat generation in electronic systems.

Maximum Operating Temperature: 70 °C

Can withstand higher operating temperatures, ensuring reliability and stability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature environments without performance degradation, suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the durability and longevity of the product.

Terminal Position: QUAD

Quad terminal position offers better electrical connectivity and signal integrity, supporting high-speed data processing and transmission.

Maximum Seated Height: 0.9 mm

Low profile design allows for compact board layouts and thinner electronic devices, enabling sleek and modern product designs.

Width: 12 mm

Moderate width dimension facilitates easy integration into standard PCB layouts and enclosures, enhancing compatibility and ease of installation.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the device during production and maintenance, reducing time and cost.

Maximum Clock Frequency: 300 MHz

High clock frequency enables rapid processing of digital signals and data, making the product suitable for real-time applications and high-speed communications.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering processes, ensuring reliable and robust solder joints for long-lasting performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and parallel processing capabilities, optimizing performance and efficiency.

Length: 12 mm

Compact length dimension allows for space-efficient placement on PCBs and compact electronic devices, contributing to overall system miniaturization.

Temperature Grade: COMMERCIAL

Suitable for standard commercial temperature range applications, providing reliable performance in typical operating environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Integration of digital signal processor and other peripherals in a single chip enhances system integration and performance, simplifying overall design complexity.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and compatibility with a wide range of digital applications, making it a versatile choice.

Terminal Form: NO LEAD

No-lead terminal form reduces soldering complexity, enhances electrical performance, and supports lead-free manufacturing processes for environmental compliance.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation, supporting optimal performance and efficiency in various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on PCBs, increasing component placement density and enabling compact system designs.

Format: FIXED POINT

Fixed-point format simplifies data processing and arithmetic operations, providing predictable and efficient execution of algorithms in signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, requiring standard precautions during storage, handling, and soldering to maintain device integrity.

Low Power Mode: YES

Low power mode option enhances energy efficiency and battery life, allowing for power optimization and extended operation in portable and battery-powered devices.

Barrel Shifter: YES

Inclusion of a barrel shifter circuit improves data manipulation and shifting operations, enhancing computational capabilities and versatility in signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF702KCPZ-3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOM SUPPLY

Address Bus Width:

0

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-XQCC-N88

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

88

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF702KCPZ-3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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