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ADSP-BF701KBCZ-2

Analog Devices

ADSP-BF701KBCZ-2 by Analog Devices

ADSP-BF701KBCZ-2 by Analog Devices is a 184-terminal DSP with max clock freq of 200 MHz. It operates at 0-70 °C, has low power mode, and features internal bus architecture for digital signal processing applications. The package style is grid array with a square shape and 0.8mm terminal pitch.

Median Price

$9.326

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 583 parts In-Stock

1+ parts

$8.680

100+ parts

-

1k+ parts

$8.250

10k+ parts

-

583

$8.680

-

$8.250

-

Mouser Electronics

USA . 32 parts In-Stock

1+ parts

$20.290

100+ parts

$11.980

1k+ parts

$11.900

10k+ parts

-

32

$20.290

$11.980

$11.900

-

Verical

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$9.326

1k+ parts

-

10k+ parts

-

540

-

$9.326

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 890 parts In-Stock

1+ parts

$7.030

100+ parts

-

1k+ parts

-

10k+ parts

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890

$7.030

-

-

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Vyrian

USA . 1,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,978

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 381 parts In-Stock

1+ parts

$6.290

100+ parts

-

1k+ parts

-

10k+ parts

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381

$6.290

-

-

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Semicontronic

India . 101 parts In-Stock

1+ parts

$6.290

100+ parts

$6.133

1k+ parts

$6.101

10k+ parts

-

101

$6.290

$6.133

$6.101

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Corphita

USA . 102 parts In-Stock

1+ parts

$6.660

100+ parts

-

1k+ parts

-

10k+ parts

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102

$6.660

-

-

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Corohmni

South Africa . 190 parts In-Stock

1+ parts

$10.620

100+ parts

-

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190

$10.620

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-

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Vigor

Singapore . 1,193 parts In-Stock

1+ parts

$10.920

100+ parts

-

1k+ parts

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1,193

$10.920

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-

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Parana Technologies

USA . 443 parts In-Stock

1+ parts

$45.204

100+ parts

-

1k+ parts

$42.039

10k+ parts

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443

$45.204

-

$42.039

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IDEA Electronic Components Group

UK . 1,324 parts In-Stock

1+ parts

$48.606

100+ parts

$46.176

1k+ parts

-

10k+ parts

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1,324

$48.606

$46.176

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DigiPath Technology Company

USA . 2,703 parts In-Stock

1+ parts

$75.825

100+ parts

$72.792

1k+ parts

-

10k+ parts

$72.792

2,703

$75.825

$72.792

-

$72.792

Native Components

USA . 276 parts In-Stock

1+ parts

$108.647

100+ parts

-

1k+ parts

-

10k+ parts

$104.302

276

$108.647

-

-

$104.302

Northwest PG Solutions

USA . 2,327 parts In-Stock

1+ parts

$119.512

100+ parts

-

1k+ parts

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10k+ parts

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2,327

$119.512

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-

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Robosynatics

Brazil . 200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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200

-

-

-

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Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$16.555

1k+ parts

$15.330

10k+ parts

$15.330

200

-

$16.555

$15.330

$15.330

Overview

Unleash the power of cutting-edge technology with the ADSP-BF701KBCZ-2 from Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality digital signal processors that are versatile and reliable. Ideal for a wide range of applications, this DSP offers high performance and efficiency, making it a must-have for any project. Experience seamless operation and superior functionality with the ADSP-BF701KBCZ-2, setting new standards in innovation and value. Elevate your work to the next level with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes it easier to integrate the DSP into various electronic devices and reduces the overall size of the product.

Maximum Supply Voltage: 1.9 V

Allows for flexibility in power supply options while maintaining stable performance.

Package Shape: SQUARE

Square shape helps optimize PCB space and facilitates efficient placement within electronic systems.

No. of Terminals: 184

Higher number of terminals allows for more connectivity options and functionality in the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array style with low profile and fine pitch enables high-density mounting and enhances signal transmission capabilities.

Minimum Supply Voltage: 1.7 V

Flexible minimum supply voltage ensures compatibility with various power sources while maintaining performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures the DSP can withstand elevated ambient temperatures without performance degradation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable operation even in cold environments.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance for optimal signal transmission.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly processes.

Maximum Seated Height: 1.7 mm

Low seated height allows for compact design and facilitates integration into space-constrained applications.

Width: 12 mm

Compact width enables efficient board space utilization and facilitates versatile mounting options.

Boundary Scan: YES

Boundary scan feature simplifies testing and debugging processes, enhancing overall product reliability.

Maximum Clock Frequency: 200 MHz

High clock frequency allows for fast data processing and efficient execution of complex algorithms.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder connections during assembly processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and facilitates efficient communication between components.

Length: 12 mm

Compact length contributes to overall space-saving design and facilitates integration into various electronic systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions typically found in commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for diverse applications and compatibility with various digital signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency and reliability.

Terminal Form: BALL

Ball terminal form simplifies soldering processes and contributes to reliable electrical connections.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and efficient signal routing in compact spaces.

Format: FIXED POINT

Fixed-point format enhances computational efficiency and precision in data processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates enhanced moisture resistance, suitable for a range of environmental conditions.

Low Power Mode: YES

Low power mode option helps reduce power consumption during idle or low-demand periods, optimizing energy efficiency.

Barrel Shifter: YES

Presence of a barrel shifter facilitates efficient and fast arithmetic operations, enhancing overall processing speed and performance.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF701KBCZ-2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOM SUPPLY

Address Bus Width:

0

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B184

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

184

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF701KBCZ-2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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