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ADSP-BF561SKBCZ-5V

Analog Devices

ADSP-BF561SKBCZ-5V by Analog Devices

Analog Devices' ADSP-BF561SKBCZ-5V is a 32-bit DSP with 23-bit address bus, operating at 533 MHz. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and CMOS technology. With a max supply voltage of 1.375 V and package style of grid array, it offers high performance in a compact form factor.

Median Price

$68.620

Lifecycle Status

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Chip1Stop

Japan . 8 parts In-Stock

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$29.100

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Analog Devices Inc

USA . 198 parts In-Stock

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DigiKey

USA . 15 parts In-Stock

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Verical

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Rochester

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Digiode

USA . 503 parts In-Stock

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Bristol Electronics

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Vyrian

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Dan-Mar Components

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Native Components

USA . 667 parts In-Stock

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$8.940

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Northwest PG Solutions

USA . 594 parts In-Stock

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$9.834

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$8.851

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Semicontronic

India . 61 parts In-Stock

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$24.730

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Corphita

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Corohmni

South Africa . 680 parts In-Stock

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Vigor

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Parana Technologies

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IDEA Electronic Components Group

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Microchip USA

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DigiPath Technology Company

USA . 3,510 parts In-Stock

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$125.188

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$120.181

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the ADSP-BF561SKBCZ-5V Digital Signal Processor by Analog Devices. Designed with precision and expertise, this high-quality product offers unparalleled performance for a wide range of applications. From audio processing to telecommunications, this DSP delivers exceptional value, efficiency, and reliability. Experience seamless operation and enhanced capabilities with Analog Devices' top-of-the-line solutions. Elevate your projects and exceed expectations with the ADSP-BF561SKBCZ-5V.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the DSP, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly of the DSP onto circuit boards, reducing production time and costs.

Maximum Supply Voltage: 1.375 V

With a maximum supply voltage of 1.375 V, this DSP is designed to operate efficiently without the risk of damage from overvoltage.

Address Bus Width: 23

A wider address bus width of 23 allows for more memory addressing capabilities, enabling the DSP to handle larger data sets and complex processing tasks.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it easier to integrate the DSP into various electronic devices.

Bit Size: 32

The 32-bit size allows for high precision and accuracy in processing digital signals, making the DSP suitable for demanding applications that require complex calculations.

Power Supplies (V): 1.2, 2.5/3.3

Multiple power supply options of 1.2V, 2.5V, and 3.3V provide flexibility in power management, allowing the DSP to be used in different voltage environments.

No. of Terminals: 256

A high number of terminals (256) allow for efficient connectivity and data transfer between the DSP and other components in the system, ensuring seamless operation.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers a compact form factor, high-density interconnects, and precise alignment during assembly, enhancing overall performance.

Minimum Supply Voltage: 0.8 V

The minimum supply voltage of 0.8V ensures that the DSP can operate efficiently even at lower power levels, optimizing energy consumption.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the DSP can withstand elevated temperatures, making it suitable for industrial applications and harsh environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures reliable operation in colder conditions, widening the range of applications for the DSP.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and corrosion resistance, ensuring reliable connections for signal transmission.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier mounting and better heat dissipation, improving overall performance and reliability of the DSP.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7mm allows for a more compact and slim design, making the DSP suitable for space-constrained applications.

Width: 12 mm

A width of 12mm provides a balance between compactness and connectivity, allowing the DSP to fit into various electronic systems while maintaining sufficient space for connections.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production and maintenance, reducing time and costs associated with troubleshooting.

External Data Bus Width: 32

A wide external data bus width of 32 allows for high-speed data transfer between the DSP and external memory or peripherals, enhancing overall processing performance.

Maximum Clock Frequency: 533 MHz

With a high maximum clock frequency of 533MHz, the DSP can handle intensive signal processing tasks with speed and efficiency, ideal for real-time applications.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures reliable soldering during assembly, maintaining strong connections and preventing damage to the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data flow within the DSP, enabling simultaneous processing of multiple instructions and enhancing overall performance.

Length: 12 mm

A length of 12mm provides a compact form factor for the DSP, allowing for easy integration into electronic devices with limited space, without compromising functionality.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges, making the DSP suitable for a wide range of commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor and other components indicates a versatile and adaptable design, allowing the DSP to be used in various applications and systems.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of applications, making the DSP energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable connections and efficient heat dissipation, ensuring stable performance, especially in applications with high thermal demands.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage of 1.25V indicates the standard operating voltage for the DSP, ensuring compatibility with various power sources and simplifying system design.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density packaging and precise alignment during assembly, enhancing overall reliability and performance of the DSP.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and control logic in the DSP, enabling efficient and accurate numerical computations for signal processing applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the DSP can withstand standard moisture exposure levels during storage and handling, ensuring reliability in various environments.

Speed: 533 rpm

With a speed of 533rpm, the DSP can process data and instructions at a high rate, enabling real-time operation and fast response times, suitable for time-critical applications.

Low Power Mode: YES

Low power mode capability allows the DSP to operate with reduced energy consumption when not performing intensive tasks, extending battery life and enhancing energy efficiency.

Barrel Shifter: YES

Barrel shifter functionality enables efficient shifting and rotation of bits within the DSP, facilitating complex arithmetic and shifting operations, essential for signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF561SKBCZ-5V attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

533 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Speed:

533 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

.8 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF561SKBCZ-5V Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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