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ADSP-BF514BBCZ-3

Analog Devices

ADSP-BF514BBCZ-3 by Analog Devices

ADSP-BF514BBCZ-3 by Analog Devices is a 32-bit DSP with 300 MHz clock frequency, suitable for industrial applications. It features a 19-bit address bus, operates at temperatures from -40 to 85 °C, and has low power mode for energy efficiency.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Verical

USA . 308 parts In-Stock

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Vyrian

USA . 5,103 parts In-Stock

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Digiode

USA . 648 parts In-Stock

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648

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Northwest PG Solutions

USA . 1,832 parts In-Stock

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$2.784

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$2.784

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Vigor

Singapore . 5,335 parts In-Stock

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$11.130

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AZTECH Wire

Italy . 857 parts In-Stock

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$19.260

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Parana Technologies

USA . 175 parts In-Stock

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$20.665

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$19.218

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$20.665

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IDEA Electronic Components Group

UK . 1,516 parts In-Stock

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$22.220

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$21.109

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Semicontronic

India . 158 parts In-Stock

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$27.000

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$26.325

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$26.190

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DigiPath Technology Company

USA . 692 parts In-Stock

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$34.663

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$33.277

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$33.277

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$33.277

Corohmni

South Africa . 221 parts In-Stock

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$49.434

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Native Components

USA . 670 parts In-Stock

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Corphita

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$20.909

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$19.362

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$19.362

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$19.362

Overview

Elevate your digital signal processing experience with the ADSP-BF514BBCZ-3 from Analog Devices. This high-quality DSP offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. With its advanced features and cutting-edge technology, this product provides customers with exceptional value and benefits. Trust Analog Devices to deliver top-of-the-line products that elevate your projects to new heights. Choose the ADSP-BF514BBCZ-3 for superior performance and unmatched quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the DSP, making it ideal for portable devices.

Surface Mount: YES

Allows for easy and secure installation on PCBs, reducing assembly time and cost.

Maximum Supply Voltage: 1.47 V

Operates efficiently within a specified voltage range, ensuring reliability and performance.

Address Bus Width: 19

Supports a wide range of memory addressing capabilities for complex processing tasks.

Package Shape: SQUARE

Facilitates uniform and compact integration within electronic systems, optimizing space usage.

Bit Size: 32

Offers high processing power and accuracy for handling intensive computational tasks.

Power Supplies (V): 1.3,1.8/3.3

Allows flexibility in power input options, catering to different system requirements.

No. of Terminals: 168

Enables seamless connectivity with other components for efficient data transfer and communication.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances thermal performance, signal integrity, and signal routing capabilities for optimal functionality.

Minimum Supply Voltage: 1.164 V

Ensures stable operation even under low voltage conditions, increasing overall reliability.

Maximum Operating Temperature: 85 °C

Supports operation in high-temperature environments, expanding the range of potential applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in cold conditions, making it suitable for various environments and industries.

Terminal Finish: TIN SILVER COPPER

Improves conductivity and corrosion resistance for long-lasting performance and signal integrity.

Terminal Position: BOTTOM

Facilitates a secure and stable connection with the PCB, reducing the risk of disconnection or damage.

Maximum Seated Height: 1.7 mm

Allows for compact and low-profile designs, contributing to space-saving configurations.

Width: 12 mm

Compact size enables easy integration into various electronic systems without occupying excess space.

Boundary Scan: YES

Simplifies debugging and testing processes, ensuring the proper functioning of the DSP.

External Data Bus Width: 16

Supports efficient data transfer between the DSP and external devices, enhancing overall processing speed.

Maximum Clock Frequency: 300 MHz

Enables high-speed processing and computations, improving overall system performance.

Internal Bus Architecture: MULTIPLE

Enhances data processing capabilities and multitasking ability for complex operations.

Length: 12 mm

Compact length allows for versatile integration into various electronic systems with limited space.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications that require robust and reliable performance in challenging environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a variety of peripheral devices and interfaces for versatile and adaptable system configurations.

Technology: CMOS

Uses low power consumption technology, increasing energy efficiency and reducing operating costs.

Terminal Form: BALL

Facilitates easy and reliable soldering onto the PCB, ensuring a secure connection.

Nominal Supply Voltage: 1.225 V

Maintains stable operation within a specific voltage range, ensuring consistent performance.

Terminal Pitch: 0.8 mm

Allows for precise and efficient connections on the PCB, reducing the risk of signal interference or loss.

Format: FIXED POINT

Provides accurate and reliable fixed-point calculations for a wide range of signal processing applications.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage, ensuring the longevity of the DSP.

Speed: 300 rpm

Operates at high speeds for quick data processing and efficient task execution.

Low Power Mode: YES

Supports energy-saving features for extended battery life and reduced power consumption.

Barrel Shifter: YES

Enhances data processing capabilities by efficiently handling arithmetic operations and data movements.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF514BBCZ-3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B168

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

168

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA168,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF514BBCZ-3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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