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ADSP-3222TG/883B

Analog Devices

ADSP-3222TG/883B by Analog Devices

ADSP-3222TG/883B by Analog Devices is a military-grade DSP peripheral with 32-bit output data bus width, operating at up to 17.24 MHz clock frequency. It features a ceramic, metal-sealed co-fired package suitable for applications requiring high performance in extreme temperatures.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 11,924 parts In-Stock

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Digiode

USA . 233 parts In-Stock

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Native Components

USA . 151 parts In-Stock

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$6.400

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One Stop Electronics

USA . 1,294 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 246 parts In-Stock

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$19.348

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Corohmni

South Africa . 956 parts In-Stock

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$26.155

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Parana Technologies

USA . 1,148 parts In-Stock

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$56.203

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$52.269

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IDEA Electronic Components Group

UK . 333 parts In-Stock

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$60.433

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$57.411

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DigiPath Technology Company

USA . 122 parts In-Stock

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$94.275

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$90.504

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Northwest PG Solutions

USA . 653 parts In-Stock

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Corphita

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Overview

Elevate your digital signal processing capabilities with the ADSP-3222TG/883B by Analog Devices. Crafted with precision and expertise, this DSP peripheral offers unparalleled performance and reliability for a wide range of applications. From military-grade operations to advanced data processing tasks, this product excels in delivering high-quality results. Experience seamless integration, optimal efficiency, and exceptional value with the ADSP-3222TG/883B. Trust Analog Devices to elevate your technology to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides high reliability and durability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for flexibility in power input and operation.

Screening Level: 38535Q/M;38534H;883B

This high screening level indicates quality testing and reliability assurance, ensuring the product meets stringent standards.

Package Shape: SQUARE

Square shape allows for efficient use of space and easy integration into various systems.

Output Data Bus Width: 32

Wide data bus width enables high-speed data processing and transfer capabilities.

No. of Terminals: 144

Sufficient number of terminals for connectivity and compatibility with multiple systems.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and signal integrity.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures efficient power usage and compatibility with various power sources.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in extreme conditions.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables the product to function in both hot and cold environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and electrical conductivity for reliable connections.

Terminal Position: PERPENDICULAR

Perpendicular terminal position facilitates easy installation and connection in various systems.

Maximum Seated Height: 4.19 mm

Low seated height allows for compact design and easy integration into space-constrained applications.

Width: 40 mm

Compact width enables the product to be easily mounted and installed in various systems.

External Data Bus Width: 32

Wide external data bus width allows for high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 17.24 MHz

High clock frequency enables fast and efficient data processing and operation.

Length: 40 mm

Optimal length for compatibility and integration into different systems.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable performance in rugged and demanding environments.

Peripheral IC Type: DSP PERIPHERAL, FLOATING POINT PROCESSOR

Advanced peripheral IC type with floating-point processor enhances computational capabilities and performance.

Technology: CMOS

CMOS technology provides low power consumption and high integration density for efficient operation.

Terminal Form: PIN/PEG

Pin/peg terminal form enables easy installation and secure connections in various systems.

Maximum Supply Current: 250 mA

Low supply current requirement ensures efficient power usage and compatibility with different power sources.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent and reliable operation.

Terminal Pitch: 2.54 mm

Optimal terminal pitch for easy installation and connection in various systems.

Technical Specifications

DSP Peripherals ADSP-3222TG/883B attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

17.24 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P144

JESD-609 Code:

e0

Length:

40 mm

Low Power Mode:

NO

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

32

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

4.19 mm

Sub-Category:

DSP Peripherals

Maximum Supply Current:

250 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

40 mm

Trade Compliance

ADSP-3222TG/883B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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