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ADM1811-10ART-REEL

Analog Devices

ADM1811-10ART-REEL by Analog Devices

ADM1811-10ART-REEL by Analog Devices is a Power Management IC with 3 terminals, operating b/w -40 to 105°C. It supports power supply circuits with a min voltage of 1V and max current of 20mA. Ideal for industrial applications due to its small size and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,557 parts In-Stock

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Digiode

USA . 712 parts In-Stock

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Native Components

USA . 71 parts In-Stock

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$0.117

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$0.113

71

$0.117

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$0.113

Northwest PG Solutions

USA . 1,139 parts In-Stock

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$0.129

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$0.114

1,139

$0.129

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$0.114

Ampacity Inc.

Singapore . 218 parts In-Stock

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$0.500

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$0.500

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One Stop Electronics

USA . 1,345 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 239 parts In-Stock

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$5.708

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$5.309

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239

$5.708

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$5.309

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IDEA Electronic Components Group

UK . 1,299 parts In-Stock

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$6.138

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$5.831

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$6.138

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$5.831

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Semicontronic

India . 1,379 parts In-Stock

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$7.500

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$7.312

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$7.275

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DigiPath Technology Company

USA . 1,911 parts In-Stock

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$9.575

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$9.192

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AZTECH Wire

Italy . 336 parts In-Stock

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$10.318

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Vigor

Singapore . 2,250 parts In-Stock

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Corphita

USA . 569 parts In-Stock

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569

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Microchip USA

USA . 299 parts In-Stock

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Overview

Upgrade your power management system with the ADM1811-10ART-REEL by Analog Devices. Manufactured with high-quality materials and a sleek design, this Power Management IC offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides customers with the value, benefits, and advantages they need to enhance their projects. From industrial settings to consumer electronics, trust Analog Devices to deliver cutting-edge solutions for all your power supply support circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs.

Package Shape: RECTANGULAR

Rectangular shape enables compact design and efficient use of space.

No. of Terminals: 3

3 terminals provide necessary connections for power management functions.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch design make the IC suitable for compact and slim devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures stable performance in various environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in installation and connection.

Maximum Seated Height: 1.12 mm

Low seated height enables space-saving design.

Width (mm): 1.3 mm

Narrow width makes the IC suitable for compact devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit ensures stable and reliable power delivery.

Minimum Supply Voltage (Vsup): 1 V

Low minimum supply voltage allows for efficient power management.

Peak Reflow Temperature °C: 240

High peak reflow temperature ensures proper soldering during assembly.

Length: 2.9 mm

Compact length contributes to overall space-saving design.

Nominal Threshold Voltage (V): +4.35V

Stable nominal threshold voltage ensures consistent performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes the IC suitable for rugged applications.

Maximum Supply Current (Isup): 20 mA

Low maximum supply current helps in efficient power management.

Terminal Form: GULL WING

Gull wing terminal form allows for easy installation and maintenance.

Terminal Pitch: 0.96 mm

Fine terminal pitch enables high-density mounting on PCB.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage allows for powering various components in the system.

Technical Specifications

Power Management ICs ADM1811-10ART-REEL attributes and parameters. Explore more Power Management ICs devices from Analog Devices

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.35V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP3,.09,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.96 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.35V

Width (mm):

1.3 mm

Trade Compliance

ADM1811-10ART-REEL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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