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ADM1294-2AACPZ-RL

Analog Devices

ADM1294-2AACPZ-RL by Analog Devices

ADM1294-2AACPZ-RL by Analog Devices is a 16-terminal chip carrier with a width of 4mm and height of 0.8mm. It operates at a supply voltage range from 2.95V to 13V, making it suitable for analog circuit applications requiring negative supply voltages up to -48V. With peak reflow temperature of 260 °C and moisture sensitivity level of 3, it offers robust performance in various surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,678 parts In-Stock

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Digiode

USA . 813 parts In-Stock

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Semicontronic

India . 1,640 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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$4.500

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$4.365

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One Stop Electronics

USA . 586 parts In-Stock

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$7.500

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$7.500

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Parana Technologies

USA . 935 parts In-Stock

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$9.130

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$8.491

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935

$9.130

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$8.491

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IDEA Electronic Components Group

UK . 1,129 parts In-Stock

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$9.817

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$9.326

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DigiPath Technology Company

USA . 861 parts In-Stock

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$15.315

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$14.702

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$14.702

861

$15.315

$14.702

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$14.702

AZTECH Wire

Italy . 715 parts In-Stock

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$19.048

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$19.048

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Native Components

USA . 616 parts In-Stock

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$19.490

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Northwest PG Solutions

USA . 817 parts In-Stock

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$21.439

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$19.295

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Component Stockers USA

USA . 405 parts In-Stock

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$99.990

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Microchip USA

USA . 3,003 parts In-Stock

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Corphita

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Overview

Enhance your electronic designs with the ADM1294-2AACPZ-RL by Analog Devices. As a trusted manufacturer in the industry, Analog Devices delivers top-quality products that are sure to exceed your expectations. This product falls under the category of Other Function Semiconductors, making it versatile for various applications. With its surface mount capability and compact square package shape, this IC is perfect for space-constrained projects. Offering a wide range of benefits such as reliable performance and efficient power management, the ADM1294-2AACPZ-RL provides exceptional value to customers looking to elevate their designs. Experience the difference with Analog Devices today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and assembly costs.

Package Shape: SQUARE

Square package shape provides stability and uniformity in PCB layout, ensuring reliable performance.

No. of Terminals: 16

Having 16 terminals provides versatility in connectivity options for various circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design offers efficient thermal management and space-saving benefits.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance for lasting performance.

Terminal Position: QUAD

Quad terminal position ensures stable electrical connections for enhanced reliability.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for compact and slim designs, suitable for space-constrained applications.

Width (mm): 4 mm

Narrow width of 4mm enables efficient use of board space for accommodating other components.

Other IC type: ANALOG CIRCUIT

Analog circuit type offers precise signal processing capabilities for high-quality performance in analog applications.

Minimum Supply Voltage (Vsup): 2.95 V

Low minimum supply voltage requirement allows for operation in energy-efficient and low-power environments.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand high-temperature soldering processes for robust assembly.

Length: 4 mm

Compact 4mm length enables space-saving installation in tight layouts without compromising functionality.

Terminal Form: NO LEAD

No-lead terminal form ensures compliance with environmental regulations and allows for lead-free soldering considerations.

Nominal Negative Supply Voltage (Vsup): -48 V

Support for a nominal negative supply voltage of -48V enables compatibility with various power requirements in the circuit.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm offers precise and secure interconnection with other components in the circuit.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product's sensitivity to moisture, allowing proper handling and storage to maintain performance and reliability.

Maximum Supply Voltage (Vsup): 13 V

High maximum supply voltage of 13V allows for compatibility with a wide range of power sources and applications.

Technical Specifications

Other Function Semiconductors ADM1294-2AACPZ-RL attributes and parameters. Explore more Other Function Semiconductors devices from Analog Devices

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage (Vsup):

-48 V

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

2.95 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

ADM1294-2AACPZ-RL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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