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ADM1032ARZ

Onsemi

ADM1032ARZ by Onsemi

ANALOG CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.846

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 171 parts In-Stock

1+ parts

-

100+ parts

$0.846

1k+ parts

$0.702

10k+ parts

$0.626

171

-

$0.846

$0.702

$0.626

Distributors (In-Stock)

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Digiode

USA . 1,660 parts In-Stock

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$0.658

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$0.658

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USA . 4,040 parts In-Stock

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Vyrian

USA . 2,898 parts In-Stock

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R&J Components

USA . 1,548 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,360 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Prism Electronics

USA . 285 parts In-Stock

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Pegasus Components GmbH

Germany . 225 parts In-Stock

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ComSIT Distribution GmbH

Germany . 196 parts In-Stock

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ComSIT USA

USA . 196 parts In-Stock

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VNN

France . 100 parts In-Stock

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Cyclops Electronics Ltd

UK . 32 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 59 parts In-Stock

1+ parts

$0.590

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59

$0.590

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Corphita

USA . 2,873 parts In-Stock

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$0.624

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Corohmni

South Africa . 356 parts In-Stock

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$0.693

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$0.693

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Andel Nordic

Denmark . 1,596 parts In-Stock

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$2.040

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$1.430

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$1.430

1,596

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$1.430

AZTECH Wire

Italy . 432 parts In-Stock

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$14.492

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Parana Technologies

USA . 5,507 parts In-Stock

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$19.786

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$18.401

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$19.786

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$18.401

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IDEA Electronic Components Group

UK . 38 parts In-Stock

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$21.275

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$20.211

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$21.275

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DigiPath Technology Company

USA . 5,507 parts In-Stock

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$33.189

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$31.861

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$31.861

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Component Stockers USA

USA . 214 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 7,724 parts In-Stock

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Continental Prestige Electronics

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TANS Electronics

Latvia . 5,309 parts In-Stock

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Argo Parts USA

USA . 4,482 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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SupplyDigital Components

Austria . 3,750 parts In-Stock

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Problanco Electronics

Mexico . 3,035 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,769 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

Israel . 2,015 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,846 parts In-Stock

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Kepictronics

USA . 422 parts In-Stock

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Perfect Parts

USA . 168 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Technical Specifications

Other Function Semiconductors ADM1032ARZ attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

120 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

ADM1032ARZ Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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