Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.
Median Price
$35.400
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Arrow
Nova Conductors
$45.650
VNN
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J3
$0.559
AZTECH Wire
$12.320
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Ampacity Inc.
$30.090
Continental Prestige Electronics
$44.737
Netroflash
Advanced Electronics
$46.563
Argo Parts USA
The close proximity of contact rows allows for efficient signal transmission, making this chip carrier socket ideal for high-performance applications.
The rectangular contact pattern provides a secure and stable connection between the chip carrier and the PCB, ensuring reliable performance under various conditions.
Specifically designed for BGA225 devices, this chip carrier socket is compatible with a wide range of integrated circuits, offering versatility and flexibility in usage.
With a surface mount termination type, this chip carrier socket can be easily and securely mounted onto the PCB, simplifying the assembly process and ensuring a stable connection.
The small contact pitch allows for a high density of connections, making this chip carrier socket suitable for applications where space is limited but a large number of connections are required.
The compact body length makes this chip carrier socket suitable for applications where size constraints are important, without compromising on performance or durability.
With 225 contacts, this chip carrier socket can accommodate a large number of connections, making it suitable for complex electronic systems and applications that require multiple input/output channels.
The straight mounting style offers ease of installation and alignment, ensuring that the chip carrier socket can be securely and accurately mounted onto the PCB without any complications.
The compression contact style provides a reliable and low-resistance connection between the chip carrier and the PCB, ensuring optimal signal transfer and minimizing signal loss.
The compact body width of the chip carrier socket allows for efficient use of space on the PCB, making it a suitable choice for applications where size optimization is a key consideration.
The slim body depth of the chip carrier socket ensures minimal protrusion from the PCB, making it a suitable choice for applications where a low profile and compact design are important.
Designed as an IC socket, this chip carrier socket provides a reliable and secure connection for integrated circuits, ensuring proper functionality and performance.
The rectangular contact configuration offers a stable and secure connection between the chip carrier socket and the integrated circuit, ensuring consistent performance and signal integrity.
Chip Carrier IC & Component Sockets 10140369-201LF attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Amphenol Communications Solutions
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10140369-201LF Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive.
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
1N4148WT
390261-2
TE Connectivity
TE Connectivity's 390261-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing and rectangular contact pattern. It features glass-filled PBT housing, solder termination, and leaf contact style. Ideal for applications requiring a 1A current rating, it operates b/w -40°C to 105°C with a dielectric voltage of 1000VAC.
ICM-624-1-GT
Adam Tech
ICM-624-1-GT by Adam Tech is a DIP24 IC socket with 24 contacts, 15.24mm PCB row spacing, and rectangular contact pattern. It has a solder termination type, operates b/w -40°C to 105°C, and supports a current rating of 3A. Ideal for applications requiring reliable chip carrier connections in electronic devices.
115-47-640-41-003000
Mill-max Mfg
IC SOCKET; Contact Finish (Termination): TIN; Contact Material: NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Mating): NOT SPECIFIED;
551-90-012-05-001005
Mill-max Mfg's 551-90-012-05-001005 is a Chip Carrier IC Socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. Designed for PGA12 devices, it features 12 Tin/Lead (Sn/Pb) contacts with Nickel (Ni) barrier finish. Ideal for electronic applications requiring reliable socket connections.
114-87-316-41-117101
Preci-dip Sa
IC SOCKET; Device Type Used On: DIP16; Housing Material: PCT POLYESTER; No. of Contacts: 16; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
27-E305
IC SOCKET; Housing Material: NYLON; Contact Material: NOT SPECIFIED; Termination Type: SOLDER; No. of Contacts: 11; Contact Finish (Mating): NOT SPECIFIED;
2-1393143-2
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
PTF08A-E
Omron
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 8; Contact Material: NOT APPLICABLE;
P6DS-04P
RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
GFZ-30-01-G-10-AD
Samtec
The Samtec GFZ-30-01-G-10-AD is a Chip Carrier IC Socket with 300 contacts. It features Beryllium Copper contact material and Gold over Nickel finish for mating. Designed for LGA300 devices, it utilizes Liquid Crystal Polymer housing material for high performance in electronic applications.
P7SA-14F-ND
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 6;
551-10-155-18-121003
Mill-max Mfg's 551-10-155-18-121003 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni), and gold (Au) termination finish with Ni barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier applications.
416-43-260-41-003000
416-43-260-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP60 devices with 60 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
PT11-0
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE;
HLS-1219-T-15
The Samtec HLS-1219-T-15 is a POLYETHYLENE chip carrier socket with 228 contacts, featuring GOLD finish for mating and termination. Designed for use on PGA228 devices, this IC SOCKET is ideal for high-performance applications requiring reliable connections.
MT78745
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
1051420132
Molex
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD NICKEL; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
2-1571586-2
TE Connectivity's 2-1571586-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, rectangular pattern, and thermoplastic housing. It has 8 contacts, solder termination, and operates b/w -55°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch and current rating of 3A in straight mounting style.
XR2A-1805
IC SOCKET; Manufacturer Series: XR2;
XR2A-4221-N
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10140369-101LF
Amphenol Communications Solutions
IC SOCKET; Device Type Used On: BGA225; Mounting Style: STRAIGHT; Contact Style: COMPRESSION; Termination Type: SURFACE MOUNT; Body Length: .925 inch;
10140369-301LF
IC SOCKET; Device Type Used On: BGA225; Mounting Style: STRAIGHT; Contact Style: COMPRESSION; Terminal Pitch (mm): 1; Mating Contact Pitch (inch): 0.039;
10140369-401LF
IC SOCKET; Device Type Used On: BGA225; Mounting Style: STRAIGHT; Contact Style: COMPRESSION; Mating Contact Pitch (inch): 0.039; Termination Type: SURFACE MOUNT;
10140369-101
IC SOCKET; Device Type Used On: BGA225; Mounting Style: STRAIGHT; Contact Style: COMPRESSION; Body Length: .925 inch; No. of Contacts: 225;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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